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A five-axis three-dimensional automatic laser engraving device and method

A laser engraving and automatic technology, applied in laser welding equipment, welding equipment, welding equipment and other directions, can solve problems such as high unit cost and low reliability

Active Publication Date: 2019-08-23
广东海鸥飞行汽车集团有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a five-axis three-dimensional automatic laser engraving equipment and method, combined with its specific method to solve the problem of low reliability and high unit cost through manual SIP chip module detection / segmentation, which is not mature at home and abroad. The problem of high-end intelligent automatic equipment specially used for pin division of high-end three-dimensional packaging SIP chip modules

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  • A five-axis three-dimensional automatic laser engraving device and method
  • A five-axis three-dimensional automatic laser engraving device and method
  • A five-axis three-dimensional automatic laser engraving device and method

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Embodiment Construction

[0013] Below in conjunction with accompanying drawing this patent is described in further detail

[0014] Such as Figure 1-Figure 3 As shown, the five-axis three-dimensional automatic laser engraving equipment includes a five-axis manipulator, a fixture, a vision system, a laser engraving system, a display screen, and an industrial computer. Within the scope, the chip can be located under the vision system when the five-axis manipulator is clamping the jig, and the chip can be moved to the laser engraving position, while the industrial computer is connected with the five-axis manipulator and the display screen.

[0015] The chip on the jig is driven by the five-axis manipulator to the vision system for visual positioning, and then the five-axis manipulator moves to the laser engraving position for engraving. The industrial computer controls the five-axis manipulator and feeds back to the display for display.

[0016] The five-axis manipulator can be replaced by a five-axis d...

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Abstract

The invention discloses a five-axis three-dimensional automatic laser engraving device and method. The device is mainly composed of a five-axis mechanical arm, a jig, a visual system, a laser engraving system, a display screen, an industrial personal computer and accessories. According to the device, overturning, movement and adjustment of the jig are achieved through a five-axis robot; data acquisition and internal algorithm treatment are conducted on a chip on the jig through the visual system, the engraving path is optimized, and then the laser engraving system is started for laser engraving. The device is mainly used for detecting / dividing a pin treated with the high-end three-dimensional packaging SIP chip module gold plating technology and solves the problems of low reliability and high unit cost of manual SIP chip module detection / division. There is no mature high-end intelligent fully-automatic device special for high-end three-dimensional packaging SIP chip module pin division at home and abroad currently, and therefore research and development of the device have extraordinary significance for improving the competitiveness of China in the international market of the chip and package test industry.

Description

technical field [0001] The invention belongs to the technical field of laser engraving, and in particular relates to a five-axis three-dimensional automatic laser engraving device and method. Background technique [0002] Laser engraving is based on numerical control technology, and laser is the processing medium. The physical denaturation of the instant melting and gasification of the processed material under laser irradiation achieves the purpose of processing. Laser processing features: no contact with the surface of the material, not affected by mechanical movement, the surface will not be deformed, generally no need to fix. Not affected by the elasticity and flexibility of the material, it is convenient for soft materials. High processing precision, fast speed, wide range of applications. [0003] On the other hand, in terms of detecting / segmenting the pins after the gold-plating process of the high-end three-dimensional packaging SIP chip module, it can only be real...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/362B23K26/70B23K37/047
CPCB23K26/361B23K26/70B23K37/047B23K2101/36
Inventor 赵烈
Owner 广东海鸥飞行汽车集团有限公司