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Powder leakage device and powder supply device for selective laser sintering single-sided powder supply

A laser sintering and powder supply device technology, which is applied in the direction of process efficiency improvement, additive manufacturing, and energy efficiency improvement, and can solve problems such as inability to accurately supply powder

Active Publication Date: 2018-01-09
ANHUI TUO BAO ADDITIVE MFG TECH CO LTD
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Problems solved by technology

[0006] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a powder leakage device and a powder supply device for selective laser sintering single-sided powder supply, which are used to solve the problems in the selective laser sintering process in the prior art. The problem of accurate powder supply

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  • Powder leakage device and powder supply device for selective laser sintering single-sided powder supply
  • Powder leakage device and powder supply device for selective laser sintering single-sided powder supply
  • Powder leakage device and powder supply device for selective laser sintering single-sided powder supply

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Embodiment Construction

[0052] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0053] see Figure 1 to Figure 6 . It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. within the scope covered by the disclosed technical content. At the same ti...

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Abstract

The invention provides a powder leaking device and a powder supply device for selective laser sintering single-sided powder supply. The powder leaking device includes: a powder funnel for holding powder for sintering; A powder leakage channel for powder supply; a bottom plate connected to the bottom of the powder leakage tube, one side of the bottom plate has a powder leakage groove for powder leakage, and the powder leakage groove is misaligned with the powder leakage channel; placed between the bottom plate and the powder leakage channel The powder leakage plate between the powder leakage pipes is slidably connected with the powder leakage pipe. The powder leakage plate has a row of powder leakage holes. When the powder leakage plate slides, all the powder leakage holes are located directly below the powder leakage channel or It is located directly above the powder leakage slot, and initially, all the powder leakage holes are located directly below the powder leakage channel. The present invention can automatically realize accurate and quantitative powder supply without manual powder replenishment.

Description

technical field [0001] The invention relates to the technical field of selective laser sintering, in particular to a powder leakage device and a powder supply device for selective laser sintering single-side powder supply. Background technique [0002] At present, 3D printers are gradually appearing in people's field of vision, and selective laser sintering (SLS) 3D printers, as an important means of industrial processing, are increasingly playing a role that cannot be ignored. This technology uses solid powder as raw material to directly convert CAD models into entities. According to factors such as material properties, part structure and process requirements, the powder spreading device of SLS3D printing equipment evenly spreads a thin layer of powder on the working platform for sintering of a layer of cross-sectional shape. The thickness, density and uniformity of the powder layer etc. directly affect the sintering quality. [0003] Powder coating is a key process that ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F3/105B29C67/04B33Y30/00
CPCB33Y30/00B22F10/00B22F12/63B22F10/28B22F12/224Y02P10/25
Inventor 周兵兵宗进王亮
Owner ANHUI TUO BAO ADDITIVE MFG TECH CO LTD
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