Interlayer alignment prompt module and method
A technology for prompting modules and prompting lights, which is applied in the direction of measuring devices, instruments, and electric devices, etc., can solve the problems of high misjudgment rate and low efficiency, and achieve the effect of improving accuracy and efficiency
Inactive Publication Date: 2016-06-29
PEKING UNIV FOUNDER GRP CO LTD +1
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[0003] The current method of operation is to use a multimeter to measure the alignment detection module after the outer layer pattern is etched on the circuit board, but this method of operation is not only inefficient, but also has a high rate of misjudgment
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[0033] In order to have a clearer understanding of the above objects, features and advantages of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.
[0034] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.
[0035] figure 1 A schematic structural diagram of an interlayer alignment prompting module according to an embodiment of the present invention is shown.
[0036] like figure 1 As shown, the interlay...
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The invention proposes an interlayer alignment prompt module and method, and the module comprises a reference hole. A reference probe is disposed below the reference hole, and is inserted into a test alignment hole of a to-be-tested multilayer circuit board; The module also comprises at least one interlayer alignment detection hole, and interlayer alignment detection probes are respectively disposed below each interlayer alignment detection hole. When the reference probe is inserted into the test alignment hole, the interlayer alignment detection probes will be inserted into the test hole of the to-be-tested multilayer circuit board. Moreover, a prompt device is disposed above the interlayer alignment detection holes, and is used for prompting whether the test hole is deviated from an interlayer alignment detection probe. According to the technical scheme of the invention, a user can accurately judge whether the detection hole on the multilayer detection board is deviated or not and the actual offset, thereby effectively improving the accuracy and efficiency of alignment detection of the multilayer detection board.
Description
technical field [0001] The invention relates to the technical field of circuit board detection, in particular to an interlayer alignment prompting module and an interlayer alignment prompting method. Background technique [0002] At present, when the industry manufactures multi-layer circuit boards, it is necessary to control the interlayer alignment, and the interlayer alignment detection module is used to replace the original X-ray equipment measurement and monitoring, and data judgment is made based on the measurement results. [0003] However, the current method of operation is to use a multimeter to measure the alignment detection module after the outer pattern is produced by etching the circuit board, but this method of operation is not only inefficient, but also has a high rate of misjudgment. [0004] Therefore, how to improve the efficiency and accuracy of alignment detection of multilayer circuit boards has become an urgent problem to be solved. Contents of the i...
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IPC IPC(8): G01B7/00G01B7/02
Inventor 曾金陈红军
Owner PEKING UNIV FOUNDER GRP CO LTD