Unlock instant, AI-driven research and patent intelligence for your innovation.

Heat dissipation framework capable of holding keyboard

A heat dissipation frame and keyboard technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve problems such as preventing problems and occupying a large space, achieving the effect of convenient placement and enhanced heat dissipation effect

Inactive Publication Date: 2016-06-29
赛屋(天津)涂层技术有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Laptops need heat dissipation, and notebook keyboards are sometimes not as convenient to use as peripheral keyboards. However, using peripheral keyboards will take up a lot of space. Preventing problems when not using peripheral keyboards often bothers us.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation framework capable of holding keyboard
  • Heat dissipation framework capable of holding keyboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] Specific embodiments of the invention will be described in detail below in conjunction with the accompanying drawings.

[0012] Such as figure 1 As shown, the invention is a heat dissipation frame that can place a keyboard, including a heat dissipation surface 1 and a support surface 2, the heat dissipation surface 1 is connected to the support surface 2 through a slideway 3, and the position of the support surface 2 is adjusted through the slideway 3 Keyboards of different sizes can be placed.

[0013] The mesh heat dissipation surface 1 is beneficial to the heat dissipation of the notebook computer.

[0014] The advantages and positive effects of the invention are: the heat dissipation effect of the notebook computer is enhanced, and the placement of the peripheral keyboard is convenient.

[0015] An embodiment of the present invention has been described in detail above, but the content described is only a preferred embodiment of the present invention and cannot be ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a heat dissipation framework capable of holding a keyboard. The heat dissipation framework comprises a heat dissipation face and support faces, wherein the heat dissipation face is connected with the support faces through slipways; and positions of the support faces can be adjusted through the slipways. A notebook computer can be placed on the heat dissipation face, so that an effective heat dissipation effect can be achieved. The keyboard can be placed below the heat dissipation framework, so that space is saved.

Description

technical field [0001] The invention belongs to the field of heat dissipation frames, and in particular relates to a heat dissipation frame on which a keyboard can be placed. Background technique [0002] Notebook computers need heat dissipation, and notebook keyboards are sometimes not as convenient to use as peripheral keyboards. However, using peripheral keyboards will take up a lot of space, and the problem of preventing them when not using peripheral keyboards often bothers us. Contents of the invention [0003] The problem to be solved by the invention is the heat dissipation of the notebook computer and the placement of the peripheral keyboard. [0004] In order to solve the above-mentioned technical problems, the technical solution adopted by the present invention is: provide a heat dissipation frame that can place a keyboard, including a heat dissipation surface and a support surface, the heat dissipation surface is connected with the support surface through a sli...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 甄洪滨
Owner 赛屋(天津)涂层技术有限公司