Unlock instant, AI-driven research and patent intelligence for your innovation.

A high-quality computer mainframe case

A technology for computers and mainframes, applied in the field of high-quality computer mainframes, can solve problems such as insufficient strength, unstable boxes, and only handling, and achieves the improvement of strength and heat dissipation performance, moisture-proof effect, and dust-proof effect. Effect

Inactive Publication Date: 2018-12-21
周霞
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] When the computer is running, the heating elements in the chassis will generate a lot of heat. If the heat cannot be discharged in time, it will affect the performance of the computer.
At the same time, computer cases are usually placed on a horizontal plane, and they can only be transported when they are moved. Some cases are placed on mobile brackets, but moving them will cause the case body to be unstable and easy to fall over.
Existing computer mainframe chassis also have shortcomings such as insufficient strength, poor dust-proof effect, poor moisture-proof effect, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A high-quality computer mainframe case
  • A high-quality computer mainframe case
  • A high-quality computer mainframe case

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] refer to Figure 1-2 As shown, a high-quality computer mainframe box includes a mainframe box 1 and a bottom box 2, the main box 1 communicates with the bottom box 2, and the main box 1 and the bottom box 2 are provided with shutters 6. The main chassis 1 is provided with five layers, which are respectively the first insulating layer 12, the first aluminum plate layer 10, the aluminum honeycomb layer 9, the second aluminum plate layer 11 and the second insulating layer 13 from the inside to the outside. The first insulating layer 12 , the first aluminum plate layer 10, the aluminum honeycomb layer 9, the second aluminum plate layer 11 and the second insulating layer 13 are integrally arranged, and the inside of the main chassis 1 is provided with a dehumidifier 14, a heat sink 4, a temperature sensor 5 and a humidity sensor 15, the temperature sensor 5 is connected to the heat dissipation device 4, the heat dissipation device 4 is provided with more than one, the humidi...

Embodiment 2

[0042] refer to Figure 1-2 As shown, a high-quality computer mainframe box includes a mainframe box 1 and a bottom box 2, the main box 1 communicates with the bottom box 2, and the main box 1 and the bottom box 2 are provided with shutters 6. The main chassis 1 is provided with five layers, which are respectively the first insulating layer 12, the first aluminum plate layer 10, the aluminum honeycomb layer 9, the second aluminum plate layer 11 and the second insulating layer 13 from the inside to the outside. The first insulating layer 12 , the first aluminum plate layer 10, the aluminum honeycomb layer 9, the second aluminum plate layer 11 and the second insulating layer 13 are integrally arranged, and the inside of the main chassis 1 is provided with a dehumidifier 14, a heat sink 4, a temperature sensor 5 and a humidity sensor 15, the temperature sensor 5 is connected to the heat sink 4, the heat sink 4 is provided with more than one, the humidity sensor 14 is connected to...

Embodiment 3

[0059] refer to Figure 1-2 As shown, a high-quality computer mainframe box includes a mainframe box 1 and a bottom box 2, the main box 1 communicates with the bottom box 2, and the main box 1 and the bottom box 2 are provided with shutters 6. The main chassis 1 is provided with five layers, which are respectively the first insulating layer 12, the first aluminum plate layer 10, the aluminum honeycomb layer 9, the second aluminum plate layer 11 and the second insulating layer 13 from the inside to the outside. The first insulating layer 12 , the first aluminum plate layer 10, the aluminum honeycomb layer 9, the second aluminum plate layer 11 and the second insulating layer 13 are integrally arranged, and the inside of the main chassis 1 is provided with a dehumidifier 14, a heat sink 4, a temperature sensor 5 and a humidity sensor 15, the temperature sensor 5 is connected to the heat dissipation device 4, the heat dissipation device 4 is provided with more than one, the humidi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a high-quality computer mainframe case. The computer mainframe case comprises a mainframe box and a bottom box, wherein the mainframe box is communicated with the interior of the bottom box; a louver is arranged on each of the mainframe box and the bottom box; the mainframe box is provided with five layers of a first insulation layer, a first aluminum plate layer, an aluminum honeycomb layer, a second aluminum plate layer and a second insulation layer from inside to outside; the first insulation layer, the first aluminum plate layer, the aluminum honeycomb layer, the second aluminum plate layer and the second insulation layer are integrally arranged; and a dehumidification apparatus, a heat dissipation apparatus, a temperature sensor and a humidity sensor are arranged in the mainframe box. The high-quality computer mainframe case is simple in design, high in strength, convenient to carry, good in heat dissipation performance, good in dust removal effect and good in moisture-proof effect.

Description

technical field [0001] The invention relates to a high-quality computer mainframe case. Background technique [0002] When the computer is running, the heating elements in the case will generate a lot of heat. If the heat cannot be discharged in time, the performance of the computer will be affected. Simultaneously, computer case is usually placed on the horizontal plane, and it can only be carried when it is moved. Some cases are placed on a mobile bracket, but it will cause the case body to be unstable and easy to topple over when moved. The existing computer mainframe case also has disadvantages such as insufficient strength, poor dust-proof effect, and poor moisture-proof effect. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a high-quality computer mainframe case with simple design, high strength, convenient handling, good heat dissipation performance, good dust-proof effect and good moisture-proof effect....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20
Inventor 周霞
Owner 周霞