A kind of conductive adhesive film and electronic equipment

Abstract

The invention discloses a conductive adhesive film and electronic equipment, and aims to solve the technical problem of relatively high conduction reject ratio when an ACF (anisotropic conducive film) is in use. The conductive adhesive film comprises an insulating adhesive layer, first conductive particles and second conductive particles, wherein the first conductive particles are arranged in the insulating adhesive layer; the first conductive particles are not deformed under external force; the second conductive particles are arranged in the insulating adhesive layer; the second conductive particles can be deformable under external force; the diameter of the second conductive particles is larger than that of the first conductive particles, wherein when the first surface of a first part is connected with the second surface of a second part through the conductive adhesive film, electric connection between a non-flat region on the first surface and the second surface can be realized through the second conductive particles; the non-flat region refers to a region, denting towards the first direction, on the first surface; and the first direction refers to a direction from the second surface to the first surface.

Description

technical field [0001] The invention relates to the field of conductive materials, in particular to a conductive adhesive film and electronic equipment. Background technique [0002] With the continuous development of science and technology, electronic technology has also developed rapidly, and there are more and more types of electronic products. For example, electronic devices such as PCs (personal computers), mobile phones, and PADs (tablet computers) have become an indispensable part of people's lives. [0003] ACF (Anisotropic Conductive Film, Anisotropic Conductive Film) is a substance mixed with insulating glue and a large number of conductive particles, which can be used to connect two different substrates or lines, making the vertical (Z axis) Electrical conduction can be realized in the direction, and insulation in the horizontal (X-axis, Y-axis) direction. ACF may be used in many current electronic devices. For example, electronic components can be connected to ...

AI Technical Summary

Problems solved by technology

[0004] As far as the current manufacturing process is concerned, the substrates connected by ACF generally cannot be guaranteed to be completely flat, such as LCD screens, PCB (Printed Circuit Board, printed circuit boards), etc., are difficult to guarantee completely flat, so When laminating two substrates, the uneven part of the substrate may not be able to connect with the conductive particles in the ACF, resulting in the inability to achieve electrical conduction between the substrates

[0005] It can be seen that the failure rate of conduction is relatively high when using ACF

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