Substrate Processing Apparatus
A plasma and processing device technology, applied in the field of substrate processing devices, can solve the problems of deposits, nozzle consumption, etc., and achieve the effect of eliminating potential difference and suppressing the generation of electric field
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[0034] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0035] figure 1 It is a cross-sectional view schematically showing the structure of the substrate processing apparatus according to the embodiment of the present invention. This substrate processing apparatus is configured to perform dry etching processing on a wafer.
[0036] exist figure 1 Among them, the substrate processing apparatus 10 has a cylindrical chamber 11 (cylindrical container) for accommodating, for example, a wafer W having a diameter of 300 mm. The disc-shaped susceptor 12 (counter electrode) of the wafer W. The chamber 11 has a cylindrical side wall 13 and a disk-shaped cover 14 (one end wall of the cylindrical container) covering the upper end portion of the side wall 13 in the drawing.
[0037] The inside of the chamber 11 is decompressed by TMP (TurboMolePump, turbo molecular pump) and DP (DryPump, dry pump) (both of wh...
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