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Processing apparatus

A technology for processing devices and workpieces, applied to fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems that the state of the cutting groove cannot be confirmed, the contrast between the cutting groove and the periphery of the cutting groove has not become clear, etc.

Inactive Publication Date: 2016-07-06
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, even when the cutting groove is imaged by the above-mentioned imaging unit, the contrast between the cutting groove and the periphery of the cutting groove is not clear, and the state of the cutting groove may not be confirmed in some cases.

Method used

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Embodiment Construction

[0023] figure 1 The shown processing device 1 is an example of a cutting device that divides a workpiece into individual devices. The processing device 1 has a device base 2, and a magazine 3 for accommodating a plurality of workpieces is disposed on the front portion of the device base 2. As shown in FIG. On the upper surface 2a of the device base 2, there is a temporary storage area 4 for temporary storage of workpieces; the loading of workpieces before cutting from the magazine 3 and loading of workpieces after cutting into the magazine 3 The unloading unit 5 ; the holding unit 6 holding the workpiece; and the first conveying unit 7 conveying the workpiece between the temporary storage area 4 and the holding unit 6 .

[0024] The holding unit 6 has a suction unit 6 a for sucking and holding the workpiece, and the suction unit 6 a is connected to a suction source not shown. The periphery of the holding unit 6 is covered with a cover portion 8 . exist figure 1 The inside ...

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Abstract

The invention discloses a processing apparatus which comprises a holding means (6) to keep a workpiece, a cutting means (10) for the workpiece held by the holding means (6) on the implementation of the processing, a machining feed unit (9) providing feed to the holding means (6) and the cutting unit (10) relatively and an imaging unit (13) to process images of the workpiece. The imaging unit comprises an illumination device (14) for workpiece machining lighting region and an image pickup device (15) for processing the imaging area to have the processing region as the center of the illumination light direction selection function (142) from any direction into East and West, and therefore from forming on the wafer (W cutting slot) on (20) in any direction with its clear contrast among surrounding East and West, by the illumination device (14) of the LED (141) for illumination and imaging by the imaging device (15).

Description

technical field [0001] The present invention relates to a processing device for performing predetermined processing on a workpiece. Background technique [0002] The wafer divided by the planned division line and formed with multiple devices such as ICs and LSIs on the surface is divided into individual device chips by, for example, a dicing device, and the divided device chips are assembled into various electrical equipment such as mobile phones and personal computers for use in . [0003] The dicing device has: a holding unit holding the wafer; a cutting unit rotatably mounted with a cutting tool for cutting the wafer held on the holding unit; a processing feeding unit for processing feeding the holding unit and the cutting unit; And a camera unit for detecting the area to be processed of the wafer. In this dicing device, the wafer is cut along the planned dividing line of the wafer by the cutting blade, and the wafer can be divided into individual device chips with high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/78
CPCH01L21/67092H01L21/78B28D5/022H01L21/67253
Inventor 花岛聪安田信哉田中诚汤泽治信
Owner DISCO CORP