A kind of processing method of pcb and pcb
A processing method and technology of gold fingers, which are applied in the direction of electrical connection of printed components, printed circuit components, and the formation of electrical connection of printed components, can solve problems affecting production efficiency, easy card board, etc., so as to improve production efficiency and solve gold-plated fingers Effects of cardboard problems
Active Publication Date: 2019-03-05
DONGGUAN SHENGYI ELECTRONICS
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Problems solved by technology
Since the core board is thin and exceeds the production capacity of gold-plated finger lines, it is necessary to increase the thickness of the core board by pasting false boards, which greatly affects production efficiency and is easy to jam
Method used
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Embodiment Construction
[0041] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.
[0042] The processing method of a kind of PCB of the present invention firstly provides a kind of stepped groove PCB that has made golden finger pattern and conductive lead wire, and described golden finger pattern is made in the corresponding position of the stepped groove of described stepped groove PCB, in the A conductive hole is processed at the conductive lead, and the gold finger pattern is electroplated through the conductive hole and the conductive lead to form a gold finger. The gold finger pattern includes a gold finger pattern in the groove and a gold finger pattern outside the groove, and the conductive lead includes a conductive lead in the groove and a conductive lead outside the groove, and the golden finger in the groove and the golden finger outside the groove are formed by one-time...
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The invention discloses a processing method of a PCB. The method provides a step groove PCB with manufactured groove inside gold finger patterns, groove outside gold finger patterns, groove inside conductive lead wires and groove outside conductive lead wires is provided. The gold finger patterns are manufactured at corresponding positions of step grooves of the step groove PCB, conductive holes are processed at the conductive lead wires, and gold fingers are formed by electroplating the gold finger patterns through the conductive holes and the conductive lead wires. After lamination and external-layer patterns are completed, groove inside gold fingers and grove outside gold fingers are electroplated, the thickness of a core plate does not have to be increased for electroplating of the groove inside gold fingers through a mode of attaching false plates, the production efficiency is improved, and the problem of board stagnation of the gilded gold fingers is solved. The conductive holes are increased through board edges, and the production efficiency can be improved by use of a mode of plating the groove inside gold fingers and the groove outside gold fingers at a time. Besides, the invention also discloses a PCB processed by use of the method.
Description
technical field [0001] The invention relates to the technical field of printed circuit board processing, and further relates to a method for processing a PCB with golden fingers, in particular to a method for processing a PCB with stepped grooves and an inner groove and an outer groove, and the PCB. Background technique [0002] Gold Finger (Gold Finger) is arranged on the circuit board and composed of golden yellow conductive sheets arranged in an arrangement, and is used for plugging into the slot of another component to conduct electrical conduction with another component. Gold fingers are called gold fingers because their surfaces are gold-plated and the conductive sheets are arranged like fingers. The gold finger is actually coated with a layer of gold on the copper sheet by electroplating or chemical plating on the copper clad board. Since the gold finger made by chemical plating is relatively hard, the gold finger is easily broken by external force; the gold finger ma...
Claims
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IPC IPC(8): H05K3/40H05K1/11
Inventor 王小平杜红兵焦其正李恢海
Owner DONGGUAN SHENGYI ELECTRONICS