Manufacturing method of arbitrary-order interconnected HDI board and HDI board
A manufacturing method and core board technology, which are applied in printed circuit manufacturing, manufacturing printed circuit precursors, and electrical connection formation of printed components, etc., can solve problems such as laser drilling, card board, affecting the yield of HDI boards, etc., and achieve product quality. Good, stable and reliable interconnection, and the effect of improving production efficiency
Inactive Publication Date: 2020-07-31
广东通元精密电路有限公司 +1
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Problems solved by technology
[0004] The purpose of the present invention is to solve the disadvantages such as laser drilling and jamming of the copper-clad core board after double-sided copper reduction treatment in the processing process of the existing arbitrary-order interconnected HDI board, which seriously affects the HDI board. The shortcoming of the yield rate of processing provides a method for manufacturing HDI boards with any order of interconnection
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[0018] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0019] The present invention provides a method for manufacturing an arbitrary-order interconnected HDI board, which is mainly to solve the common need for a copper reduction step in the current HDI board processing process, which leads to laser drilling and board jamming in the subsequent processing after the copper reduction step. And other technical problems lead to the problem of low yield of HDI boards.
[0020] see figure 1 , is a flow chart of a specific embodiment of a method for manufacturing an arbitrary-order interconnection HDI board provided by the present invention. A method for manu...
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The invention provides a manufacturing method of an arbitrary-order interconnected HDI board. The manufacturing method comprises the steps of cutting, plasma activation, electroplating, tool hole manufacturing, laser drilling, hole metallization treatment and post-treatment. According to the manufacturing method of the arbitrary-order interconnected HDI board, an inner-layer core plate is processed and manufactured by selecting a core plate without copper coating on the surface; plasma activation is carried out on the inner-layer core plate; the surface activity of the inner-layer core plate is improved; re-plating is carried out; the quality of the copper plating layers on the two sides of the inner-layer core plate is ensured; meanwhile, in the manufacturing method, the copper reductionstep needing to occur in an existing machining method is avoided, so that the problems that laser drilling is prone to drilling through and plate clamping due to uneven double-face copper reduction are solved; the inner-layer core plate with stable mechanical performance is provided for subsequent machining; and the machining yield of the HDI board is effectively increased. The invention further provides the HDI board. The HDI board is manufactured according to the manufacturing method of the arbitrary-order interconnected HDI board.
Description
technical field [0001] The invention relates to the technical field of printed circuit board processing and manufacturing methods, in particular to a method for manufacturing an arbitrary-order interconnected HDI board and the HDI board. Background technique [0002] With the development and progress of science and technology, electronic products are gradually developing in the direction of miniaturization, portability and multi-function. In order to meet the new market requirements, high-density interconnection boards, namely HDI boards, have come to the forefront of the development of printed circuit board technology. and increasingly popular. The HDI board has the advantages of low cost, high circuit density, and high reliability, which is conducive to the use of advanced construction technology and can be widely used in mobile phones, digital cameras, and IC substrates. HDI (High Density Interconnector, high-density interconnection) board is a highly dense integrated ci...
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IPC IPC(8): H05K3/00H05K3/02H05K3/42H05K1/11
CPCH05K1/115H05K3/0041H05K3/0047H05K3/022H05K3/421
Inventor 陈志宇
Owner 广东通元精密电路有限公司