Socket for testing connector of circuit board
A technology for testing circuit boards and connectors, which is applied to components of connecting devices, measuring devices, circuits, etc., can solve problems such as increased testing costs, long connection time, poor compatibility, etc., to solve card board problems and reduce testing costs , the effect of high test efficiency
Inactive Publication Date: 2003-10-22
ZTE CORP
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Problems solved by technology
But this method has the following disadvantages: 1. The connection takes a long time and the efficiency is low
Especially when testing backplanes with a large number of connectors, it takes a lot of time to connect mating mating connectors
2. Poor compatibility
Whenever a different type of connector is used, it must be replaced with a matching connector for testing, which increases the cost of testing
3. Low service life
But this accepting device can only be used for testing the few circuit boards of test points, but has following shortcoming when testing the circuit board with thousands of test points and a large number of connectors: Measuring the board, it is easy to cause the jamming phenomenon
Because the diameter of the positioning hole of the tested board cannot be guaranteed to be exactly the same during processing, and in addition, during the test process, the tested board has to be pressed down repeatedly, and the positioning pin is easily deformed, so it is easy to cause board jamming
2. When the pressure is high, only some springs are added between the low-molded frame and the guard plate, which cannot ensure the balance and stability of the pressure, and cannot effectively control the size of the pressure, so the board under test may be stuck in the test probe. The situation in the needle
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[0011] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0012] Such as figure 1 As shown, the receiving device of the test circuit board connector includes three parts: a low mold frame 11, a board positioning frame 12 and an upper die 13; 20 is a board under test with a connector, and 21 is a board on the board under test Connectors, several rows of test probes 16 are distributed on the upper surface of the low mold frame 11. In practical application, the low-form frame 11 is at the lowest floor, fixed on the operating table, and its bottom surface is in contact with the operating table. The low-mode frame 11 is a frame structure made of non-conductive material, the material can be selected from Bakelite or polyester material, processed into the required size, and connected into a box with screws. The height can be determined according to the height of the operating table and the operating height of the operato...
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A socket for testing connector of circuit board is composed of bottom mould frame, locating frame of the board to be tested, upper press mould, test probes to contact with the points to be tested, and guide axle and bearing for linking upper press mould, said locating frame and bottom mould frame. Under the action of pressing, the test probes on bottom mould frame are in contact with the spring sheets of the connector to be tested. Its advantages include high efficiency and compatibility and long service life.
Description
technical field [0001] The invention relates to a test fixture, in particular to a receiving device for testing circuit board connectors. Background technique [0002] In the current circuit design, the connector has become a commonly used component, which is used to centrally connect the signal lines of the circuit board, especially the components used in the backplane of the circuit equipment are almost all connectors, so the test Whether the connector is connected correctly or not becomes a very important and necessary work. Generally, the device for testing the connector is to use a connector that matches the connector on the board under test to form a connection fit (generally a plug and socket connection fit) for testing. The patents with application numbers 97104825.8 and 98108007.3 applied by Sumitomo Corporation in China all adopt this method. But this method has the following disadvantages: 1. The connection takes a long time and is inefficient. Especially when ...
Claims
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Login to View More IPC IPC(8): G01R31/04H01R13/00H01R43/00
Inventor 刘燕曾昭祥李宏伟
Owner ZTE CORP