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Printed circuit board and method of manufacturing the same

A technology of printed circuit boards and circuit patterns, applied in the direction of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve problems such as limited reliability of data

Active Publication Date: 2016-08-03
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, some existing components are manufactured for embedding into printed circuit boards, but there is limited data confirming the reliability of embedded components

Method used

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  • Printed circuit board and method of manufacturing the same
  • Printed circuit board and method of manufacturing the same
  • Printed circuit board and method of manufacturing the same

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Embodiment Construction

[0052] The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatus and / or systems described herein. However, various changes, modifications, and equivalents thereof to the methods, devices, and / or systems described herein will be apparent to those of ordinary skill in the art. The order of operations described herein is an example only, and is not limited to what is set forth herein, but changes may be made that will be apparent to those of ordinary skill in the art, except for operations that must occur in a particular order. Also, descriptions of functions and constructions that are well known to one of ordinary skill in the art may be omitted for increased clarity and conciseness.

[0053] The features described herein may be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein have been provided so that this discl...

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Abstract

There are provided a printed circuit board and a method to manufacture the same. The printed circuit board includes a core board including an insulating layer and a cavity, an electronic element in the cavity, and an insulating member disposed between inner surfaces of the cavity and the electronic element. A modulus of elasticity of the insulating member is lower than a modulus of elasticity of the insulating layer.

Description

[0001] This application claims priority and benefit from Korean Patent Application No. 10-2015-0010680 filed with the Korean Intellectual Property Office on January 22, 2015, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The following description relates to a printed circuit board and a method of manufacturing the same. Background technique [0003] Today's higher-functioning portable devices require smaller, lighter and thinner electronic components. Throughout the development of packaging miniaturization, the technology has evolved from two-dimensional packaging to three-dimensional packaging to achieve high-density packaging. However, some existing components are manufactured with the purpose of being embedded into printed circuit boards, but there is limited data confirming the reliability of the embedded components. [0004] Therefore, there is a need to develop new technologies to improve the functions of printed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/30
CPCH05K1/185H05K3/30H05K2201/0133H05K1/0271H05K1/186H05K2201/0187H01L2224/04105H01L2924/3511H05K1/0298H05K3/4626H05K3/4697
Inventor 李斗焕金宗立申雄熙赵成焕
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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