Automatic circuit board separation equipment and method

Abstract

The invention discloses automatic circuit board separation equipment and a method. The equipment comprises a stand, a feeding device and a board separation device; the board separation device includes an upper mold, a lower mold, a fixed module and a movable module; the upper mold is butted against or far from the lower mold in the longitudinal direction; a machining area is formed between the upper mold and the lower mold; the fixed module includes an upper fixed part and a lower fixed part respectively arranged on the upper mold and the lower mold; the movable module includes an upper movable mold and a lower movable mold respectively arranged on the upper mold and the lower mold; the upper mold is butted against the lower mold in the longitudinal direction, so that the movable module can be staggered from the fixed module in the longitudinal direction under the effect of an elastic device; and the feeding device feeds an integral circuit board onto the machining area, and sends independent circuit boards away from the machining area. The method adopts the equipment to separate the circuit board. The equipment and the method have the advantage of capability of automatically separating the integral circuit board consisting of multiple single circuit boards to multiple independent circuit boards.

Description

(1) Technical field [0001] The invention relates to a circuit board automatic board splitting device and method. (2) Background technology [0002] In the production technology of existing circuit board (circuit board), people often assemble a plurality of smaller circuit boards (as attached figure 1 shown) to a large circuit board (as shown in the attached figure 2 And attached image 3 As shown), in order to improve production efficiency, however, in the assembly site, each smaller circuit board in the large circuit board needs to be disassembled (or cut), that is, the circuit board needs to be divided (along the score line apart). [0003] In the prior art, there are usually two ways to divide the board by hand and by machine. Among them, the way of manual division is adopted, and the manual needs to use the vise to divide the board according to the cutting line. This manual operation is time-consuming and laborious, and the efficiency is very low. , has been unable ...

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Problems solved by technology

[0003] In the prior art, there are usually two ways to divide the board by hand and by machine. Among them, the way of manual division is adopted, and the manual needs to use the vise to divide the board according to the cutting line. This manual operation is time-consuming and laborious, and the efficiency is very low. , has been unable to meet the needs of the production and development of the enterprise; and for the latter, the machine splitting method is used, which is complicated to operate, and the milling cutter of the splitting machine is easy to cut the circuit board or damage the circuit board that has been soldered on the board. with electronic components, affecting product quality and performance

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