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RTP lamp base improvement

A base and light bulb technology, applied to electrical components, ohmic resistance heating devices, circuits, etc., can solve the problems of time-consuming, cost-effective and low cost

Active Publication Date: 2016-09-07
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Disassembling the chamber to remove the lamp is time consuming and not cost effective

Method used

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  • RTP lamp base improvement
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Examples

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Embodiment Construction

[0014] Improved lamps are described, providing the advantage of removing these lamps from the heat treatment chamber containing the lamps.

[0015] figure 2 This is a cross-sectional view of a lamp 100 used in an RTP chamber (not shown) according to a specific embodiment. The lamp 100 includes a bulb 110 and a lamp base 130. The bulb 110 is connected to the lamp base 130 through a sealing member 136. The lamp base 130 includes a bushing 131 surrounding a longitudinal axis (not shown), a sealed end 134 (also called a first end), and a plug end 138 (also called a second end), and the bushing 131 has one or more bushing walls 132, and the plug end 138 is opposite to the sealed end 134. The sealed end 134 surrounds the seal 136. The cross-section of the bushing 131 may be circular, square, rectangular, or any shape normally possessed by the bushing. The plug end 138 is coupled with the plug 120. The encapsulating compound 140 fills the bushing 131 including the area between one ...

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PUM

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Abstract

A lamp device for thermal processing of a substrate is provided. The lamp device includes a bulb enclosing a filament, the filament having a pair of leads. The lamp device further includes a lamp base. The lamp base includes a seal connecting the bulb to the lamp base; a sleeve having one or more walls and two ends with one end surrounding the seal; a potting compound filling the sleeve; one or more wires distributed through the sleeve and the potting compound and coupled to the pair of leads; and one or more hookable features located within 10 mm of the sealing end.

Description

Technical field [0001] Aspects of the described embodiments generally relate to heat treatment for semiconductor substrates. More specifically, the described embodiment relates to a lamp device having features that simplify the removal of the lamp device from the heat treatment chamber when the lamp device is damaged. Background technique [0002] Rapid thermal processing (RTP) is a thermal processing technique that allows rapid heating and cooling of substrates (such as silicon wafers). RTP wafer processing applications include annealing, dopant activation, rapid thermal oxidation, silicidation, and other applications. Typical peak treatment temperatures can range from about 450°C to 1100°C. In the RTP chamber, it is usually heated by a lamp device arranged above or below the substrate being processed. [0003] Fig. 1 is a schematic front view of a conventional lamp 50 used in an RTP chamber (not shown). The bulb 70 is connected to the lamp base 60 through the sealing member 8...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/324
CPCH05B3/0047
Inventor 约瑟夫·M·拉内什道格拉斯·R·麦卡利斯特
Owner APPLIED MATERIALS INC
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