Embossing device

Abstract

An object of the present invention is to provide an imprint apparatus capable of achieving uniform transfer irrespective of the thickness of a substrate. The imprint apparatus (1) of the present invention includes: a stage (40) having a mounting area (41) for mounting a substrate (71) coated with a transfer target; and a mold (30) in the form of a thin plate. Shaped and flexible, the mold (30) has tiny patterns (33) on the first surface (31) opposite to the loading area (41) of the platform (40), and is maintained with a prescribed tension; And a pressing roller (10), which can press the second face (32) opposite to the first face (31) of the mold (30), the platform (40) has a plurality of adsorption holes ( 43), the suction holes (43) start to suck synchronously with the movement of the pressing roller (10).

Description

technical field [0001] The present invention relates to an imprint apparatus for forming minute patterns. Background technique [0002] In recent years, in the optical elements used in products such as displays and lighting, it is desired to realize devices that have discovered new functions that have not been found before. The devices are formed by forming tiny patterns (on the order of nanometers (nm) to the order of micrometers (μm)) that exhibit special optical properties. ) to control the reflection and diffraction of light. As a method of forming a fine pattern as described above, in addition to photolithography and electron beam etching, imprint technology has attracted attention in recent years. The imprint technique refers to a technique of transferring a microscopic pattern of a mold by pressing a mold having a micropattern formed on its surface against a body to be transferred. [0003] Specific methods include thermal imprinting and UV imprinting. The thermal ...

AI Technical Summary

Problems solved by technology

[0012] However, in the imprint method described in Patent Document 1, there is a problem that when the end portion of the substrate 71 has a step difference, after the pressing roller 10 passes the end portion of the substrate 71, the mold 30 is lifted from the substrate 71, causing the substrate The transfer of minute patterns at the end of 71 deteriorates significantly

For example, if Figure 11 As shown, when the substrate 71 is thicker than the flat plate 40 provided around the substrate 71, the stress of the pressing roller 10 concentrates on the corners of the substrate 71, thereby causing the mold 30 to bend and possibly float from the substrate 71.

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