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Base-material-free adhesive tape processing technology avoiding tool marks on ultralight base films

A processing technology and adhesive tape technology, applied in the field of adhesive products processing technology, can solve the problems of cut marks left on the release film, affecting product quality, excessive half-cut, etc., to achieve simple product processing technology, avoid difficult control of depth, and ensure The effect of product quality

Inactive Publication Date: 2016-09-21
SUZHOU ANJIE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the process of the above-mentioned adhesive product processing, half-cutting is performed on the die-cutting machine from the double-sided adhesive surface to the release film, and the half-cut depth cannot be effectively controlled in actual operation, and excessive half-cutting is prone to occur, resulting in cuts left on the release film. scratches, easy to break, but this situation is difficult to be detected in the finished product inspection process, resulting in products that do not meet market demand, affect product quality, and cause sales difficulties

Method used

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  • Base-material-free adhesive tape processing technology avoiding tool marks on ultralight base films
  • Base-material-free adhesive tape processing technology avoiding tool marks on ultralight base films
  • Base-material-free adhesive tape processing technology avoiding tool marks on ultralight base films

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Embodiment Construction

[0018] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.

[0019] (1) if figure 1 As shown, the surface of the non-substrate adhesive tape 1 is compounded with the first release film 2;

[0020] (2) Forming without base material tape, using a tape die-cutting molding tool to punch out the shape of the base material tape, and get rid of tape waste and the first release film 2 respectively;

[0021] The specific operation of this step is: fix the base-less tape forming tool on the die-cutting machine, set the punching step according to the product and operation requirements, and send the material that has completed step (1) into the designated position of the die-cutting machine, without base material. The tape die-cutting tool punches out the overall shape of the tape to obtain the molded non-substrate tape 11. After the die-cutting is completed, the tape die-cutting tool rises and separates, and the ...

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Abstract

The invention relates to a processing technology, in particular to a base-material-free adhesive tape processing technology avoiding tool marks on ultralight base films. The processing technology comprises the following steps: (1) first release films are composited on the upper surface and the lower surface of a base-material-free adhesive tape; (2) the base-material-free adhesive tape is shaped, wherein an adhesive tape die-cutting forming tool is used and punches the base-material-free adhesive tape in a certain shape, and adhesive tape waste and the first release films are removed; (3) a release film is shaped, a second release film and a first protection film are composited sequentially on the surface of the formed base-material-free adhesive tape, a release film die-cutting tool is used and punches the release film in a certain shape, the shaped release film is obtained, second release film waste and the protection film are removed, and the base-material-free adhesive tape is obtained. The base-material-free adhesive tape and the release films are processed separately, and accordingly, the phenomenon that the release films have tool marks and are easy to break is avoided.

Description

technical field [0001] The invention relates to a processing technology, in particular to a processing technology of adhesive products. Background technique [0002] Die-cutting products are widely used in automobile manufacturing and electronics industry. With the rapid development of technology, the die-cutting process has gradually expanded from the traditional die-cutting of printed matter to the production of auxiliary materials for electronic products. Electronic product bonding, insulation materials, dustproof, shockproof, insulation, shielding adhesive products and film products, play a protective role. [0003] The prior art process of die-cutting adhesive products generally includes the following steps: compounding release film and protective film on double-sided adhesive tape; die-cutting double-sided adhesive tape; die-cutting release film; die-cutting protective film to obtain adhesive Finished sticky products. [0004] However, in the process of the above-men...

Claims

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Application Information

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IPC IPC(8): C09J7/00
CPCC09J7/00
Inventor 王春生贾志江李永泉
Owner SUZHOU ANJIE TECH
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