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A package that uses a passivation layer to prevent surface overflow of plastic encapsulants

A technology of passivation layer and package, applied in the direction of electrical components, semiconductor devices, electric solid devices, etc.

Active Publication Date: 2019-07-09
HUATIAN TECH XIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The passivation layer effectively prevents the surface from overflowing the plastic encapsulant

Method used

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  • A package that uses a passivation layer to prevent surface overflow of plastic encapsulants
  • A package that uses a passivation layer to prevent surface overflow of plastic encapsulants
  • A package that uses a passivation layer to prevent surface overflow of plastic encapsulants

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Embodiment Construction

[0011] A package that uses a passivation layer to prevent the surface from overflowing with plastic encapsulants. The package includes a chip 1, a wire bonding area 2, a chip sensing area 3, a bonding wire 4, and a plastic package 5. The chip 1 has a square structure as a whole, and four sides on one side Each corner is a quarter cylindrical space bonding area 2, and the remaining part forms a cross-like structure. In the middle of the cross-like structure is a square chip sensing area 3, and there is a circular passivation layer 6 on the upper part of the chip sensing area 3. Covering, the plastic package body 5 wraps the chip 1 , the passivation layer 6 , and the bonding wire 4 . The middle of the passivation layer 6 is hollowed out to expose the sensing area 3 of the chip.

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Abstract

The invention discloses a packaging part capable of preventing a plastic packaging material from overflowing out of a surface by a passivating layer. The packaging part comprises a chip, routing regions, a chip induction chip, a bonding wire, and a plastic packaging body, wherein the overall chip adopts a square structure; the four corners on one surface are the routing regions of a 1 / 4 cylindrical space, and the rest part forms a cross-shaped like structure; the square chip induction region is arranged on the middle part of the cross-shaped like structure; the upper part of the chip induction region is covered with a circular passivating layer; and the chip, the passivating layer and the bonding wire are wrapped with the plastic packaging body. The packaging part has the characteristic of preventing the plastic packaging material from overflowing out of the surface.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to a package that uses a passivation layer to prevent the surface from overflowing with plastic encapsulant. Background technique [0002] In the prior art, the chip has a square structure as a whole, and the four corners of one side are cut to a quarter-cylindrical wiring area, and the remaining part forms a cross-like structure; in the middle of the cross-like structure is a square chip sensing area . During the manufacturing process, it is difficult to achieve a tight fit between the film and the surface of the chip, and there may be gaps in the four directions of the cross-like structure, resulting in overflow of the plastic encapsulant. Contents of the invention [0003] In order to solve the above-mentioned problems in the prior art, the present invention discloses a package that uses a passivation layer to prevent surface overflow of plastic compound. Through the constru...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31
CPCH01L23/3171H01L23/3185H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/1815H01L2924/00014
Inventor 谢建友
Owner HUATIAN TECH XIAN
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