Chip shielding structure and mobile terminal
A shielding structure and mobile terminal technology, applied in the fields of magnetic field/electric field shielding, printed circuit components, electrical components, etc., can solve problems such as chip damage, achieve the effect of reducing damage, reducing damage, and protecting chips
Inactive Publication Date: 2016-11-16
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0003] Embodiments of the present invention provide a chip shielding structure and a mobile terminal to solve the problem of chip damage caused by deformation of the shielding structure in the prior art
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[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.
[0020] Please refer to figure 1 , figure 1 It is a structural schematic diagram of the first preferred embodiment of the chip shielding structure of the present invention. The chip shielding structure is used to protect and shield the chips on the PCB. In this preferred embodiment, the chip shielding structure includes a shielding cover 11 , a heat conduction protection member 12 and a shielding bracket 13 . Wherein, the heat-conducting protection member 12 includes a stack...
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Abstract
The invention provides a chip shielding structure and a mobile terminal. The chip shielding structure comprises a shielding cover and a heat-conducting protective part arranged on the shielding cover, wherein the heat-conducting protective part comprises stacked hard protective plate and heat-conducting soft cushions; and when the shielding cover covers a chip, the heat-conducting protective part is located between the shielding cover and the chip and abuts against the chip. According to the chip shielding structure provided by the invention, the heat-conducting protective part is arranged on the shielding cover; and the heat-conducting protective part comprises the stacked hard protective plate and heat-conducting soft cushions, and since the hardness of the hard protective plate is greater than that of the shielding cover, the chip shielding structure plays a certain deformation-resisting role when subjected to by external impact force; and meanwhile, the impact force is distributed on the whole chip to reduce the local damage of the chip. Furthermore, the heat-conducting soft cushions can also play a certain buffer role; and the damage to the chip is further reduced, so that the effect of protecting the chip is achieved.
Description
technical field [0001] The invention relates to the field of mobile terminals, in particular to a chip shielding structure and a mobile terminal. Background technique [0002] In mobile terminals, in order to solve the problem of chip heat dissipation, a piece of thermal silica gel is often placed between the chip and the shielding cover. The thermal silica gel is in contact with the chip and the shielding cover, and the heat emitted by the chip is dissipated from the shielding cover through the thermal silica gel. go out. Although this structure can well solve the problem of heat dissipation of the chip, in daily use, the mobile terminal is sometimes subject to external impact. When the impact is applied to the corresponding mobile phone case directly above the chip, the mobile phone case will Both the shielding cover and the shielding cover will have a certain amount of deformation. In severe cases, it is easy to cause deformation of the shielding cover and damage to the ...
Claims
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Login to View More IPC IPC(8): H05K1/02H05K9/00
CPCH05K1/0209H05K9/0024
Inventor 李勇
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD