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Method and device for cleaning polymer on ceramic parts
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A technology for cleaning devices and ceramic parts, applied in the direction of cleaning methods using tools, cleaning methods and utensils, chemical instruments and methods, etc., can solve problems such as high cost, low efficiency, and affecting product production, and achieve cost and time savings. Guarantee the effect of processing and improve work efficiency
Active Publication Date: 2019-01-22
FOUNDER MICROELECTRONICS INT
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[0004] The invention discloses a method and a device for cleaning polymers on ceramic parts, which are used to solve the problems of high cost and low efficiency in cleaning the polymers on ceramic parts in the reaction chamber of a dry etching machine in the prior art, and the impact Issues in post-production production
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Embodiment 1
[0044] figure 1 It is a flow chart showing the cleaning method of the polymer on the ceramic part described in the first embodiment of the present invention.
[0045] see figure 1 Shown, the cleaning method of polymer on the ceramic part of the embodiment of the present invention comprises:
[0046] Step 11, controlling a cleaning device to form a preset angle with the fixed ceramic part, and pushing the cleaning device to scrape off the first part of polymer on the ceramic part;
[0047] Step 12, performing sandblasting on the ceramic part from which the first part of polymer has been scraped off, to remove the second part of polymer on the ceramic part;
[0048] Step 13 , cleaning the remaining impurities on the ceramic part from which the second part of polymer has been removed, and performing dehydration treatment on the ceramic part to complete the cleaning of the ceramic part.
[0049] In step 11, a removal device is used to remove the first part of the polymer on the...
Embodiment 2
[0071] figure 2 A flow chart showing the cleaning method of the polymer on the ceramic piece described in the second embodiment of the present invention.
[0072] see figure 2 As indicated, cleaning methods for polymers on ceramic parts may include:
[0073] S21, the blade forms an angle of 45 degrees with the plane of the ceramic part to remove the polymer;
[0074] In S21, the preset angle between the control blade and the plane of the ceramic part is 45 degrees, of course, it can also be other angles such as 30 degrees, 40 degrees, 50 degrees or 55 degrees, etc., preferably 45 degrees, at this time, the operation is convenient , to facilitate the implementation of cleaning steps to achieve better polymer cleaning effect.
[0075] S22, using a sand blasting process to remove the residual polymer on the ceramic part through sand high-density friction;
[0076] Through S22, the surface of the ceramic part after S21 is sandblasted for secondary treatment of the polymer, a...
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Abstract
The invention provides a cleaning method and a cleaning device for polymers on ceramic components, and relates to the field of semiconductor integrated circuit manufacture. The method comprises the steps that a removing device is controlled to form a preset angle with a fixed ceramic component, and the removing device is pushed to scrape a first part of polymers on the ceramic component; the ceramic component of which the first part of polymers is already scraped is subjected to sand blasting, so that a second part of polymers on the ceramic component is removed; remaining impurities on the ceramic component on which the second part of polymers is already removed are cleaned; and the ceramic component is subjected to dehydration treatment, so that cleaning for the ceramic component is finished. By adopting the scheme disclosed by the invention, the problems in the prior art that during cleaning for polymers on ceramic components in the reaction cavity of a dry etching machine, cost is high; efficiency is low; and subsequent product production is affected are solved.
Description
technical field [0001] The invention relates to the field of semiconductor integrated circuit manufacturing, and more specifically, to a method and device for cleaning polymers on ceramic parts. Background technique [0002] Nowadays, the dry oxide layer etching machines in 6-inch semiconductor wafer manufacturing plants are generally Lam590 and Lam4520. The silicon wafer placed flat on the lower electrode forms the required pattern. At the same time, part of the by-products generated during the reaction process are deposited on the parts in the chamber to form polymers. In order to ensure the product yield, the equipment personnel will regularly clean the polymers in the reaction chamber. There are many ceramic parts in the reaction chamber of these two types of equipment. Since the ceramic parts are fragile, the removal of the polymer on the ceramic parts is the most distressing thing for the equipment personnel. The cleaning method of the polymer on the inner ceramic pa...
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Application Information
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