grinding device

Abstract

Grinding equipment is provided to reduce the amount of slurry used and to recycle the slurry efficiently. The grinding device (1) has a slurry circulation member (50) that retains the slurry (45) on the lower side of the chuck table (3) and circulates the slurry (45) to the grinding surface (25a) of the grinding pad (25). ), the slurry circulation member (50) has: a concave barrel portion (51), which retains the slurry (45) around the chuck table (3); and an air supply member (55), which is retained in the The slurry in the barrel (51) has an air ejection port (56) that ejects air toward the grinding surface (25a), so the slurry (45) can be stored in the barrel (51) and the air supply member (55) The air can be ejected from the air ejection port (56) and the slurry (45) remaining in the barrel (51) can be ejected to circulate the slurry (45) to the polishing surface (25a) of the polishing pad (25). Thereby, the usage amount of the slurry (45) is reduced and the slurry (45) is efficiently recycled.

Description

technical field [0001] The present invention relates to a polishing apparatus for polishing a wafer while supplying slurry to a polishing surface of a polishing pad. Background technique [0002] Since the flexural strength of a wafer decreases when a workpiece such as a wafer is ground and thinned, the flexural strength is increased by grinding the processed surface of the wafer. As an apparatus for polishing a wafer, for example, a polishing apparatus capable of polishing a wafer by a chemical mechanical polishing method called CMP (Chemical Mechanical Polishing) is used. Generally, the polishing apparatus adopts a structure in which a polishing pad is arranged on the lower side and a holding part for holding the wafer is arranged on the upper side, and the wafer is pushed against the polishing pad while supplying slurry (polishing liquid) to the polishing surface of the polishing pad. grind. In a dedicated device for grinding only, it has been proposed to recover the sl...

AI Technical Summary

Problems solved by technology

[0006] However, in the above-mentioned polishing device capable of recycling the slurry, since the slurry is continuously supplied to the polishing surface of the polishing pad when the wafer is polished, the amount of slurry used increases, resulting in poor economic efficiency.

And, when the wafer is ground by the above-mentioned processing apparatus, since the slurry supplied to the wafer falls from the peripheral edge side of the chuck table holding the wafer and mixes with the grinding waste liquid during grinding, the slurry It is difficult to reuse

In order to reuse the slurry, it is necessary to adopt a device structure in which the slurry does not mix with the grinding waste liquid, but it is difficult to adopt such a structure

In addition, since it is also difficult to recover only slurry from the grinding waste liquid mixed with slurry, the reusable slurry is discarded together with the grinding waste liquid, and a lot of slurry is wasted.

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