Pressing device of automatic CPU taking-putting module
A technology of automatic pick-and-place and pressing device, which is used in the detection of faulty computer hardware, instruments, manufacturing tools, etc., and can solve problems such as heavy equipment, low computing power, and damage to the motherboard.
Pending Publication Date: 2016-12-07
ZHONGSHAN TUODIAN ELECTRONICS TECH
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Problems solved by technology
[0002] The computer motherboard needs to be tested before leaving the factory. The CPU needs to be installed on the CPU mounting seat on the motherboard. In the traditional testing process, the CPU needs to be manually installed on the motherboard and then tested. The existing CPU automatic pick-and-place equipment, Press the entire device directly onto the motherboard, and then test it. This device is suitable for CPUs with low power and low computing power; however, for high-power, high-performance servers and workstation CPUs, such as Intel LGA3647 server CPUs, it has 3647 contacts, and it needs to load a very large force during normal operation, and the CPU automatic pick-and-place module needs to add higher-performance heat dissipation, compression, and self-adaptive positioning devices, which makes the whole device very heavy. If the pressure is directly loaded on the motherboard It is easy to deform the motherboard and damage the motherboard
Method used
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[0013] The embodiments of the present invention will be described in detail below in conjunction with the drawings.
[0014] Such as Figure 1 to Figure 3 As shown, this embodiment includes a motherboard 802 and a CPU mounting seat 803 arranged on the motherboard 802. An outer frame 804 is provided on the outside of the CPU mounting seat 803. A back plate 806 is provided on the back side of the motherboard 802 and corresponding to the outer frame 804. The frame 804 is connected to the back plate 806, and the outer frame 804 is connected to the locking device 7 of the CPU automatic pick-and-place module 10. The present invention is provided with an outer frame 804 and a back plate 806 connected to each other on the front and back of the main board 802. During the automatic CPU pick-and-place operation, the CPU automatic pick-and-place module 10 is directly pressed on the outer frame 804, and then the pressure is transmitted to the workbench where the motherboard is placed through ...
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The invention discloses a pressing device of an automatic CPU taking-putting module. An outer frame and a backplane which are mutually connected are arranged at the front and the back of a main board, when a CPU is automatically taken and put, the automatic taking-putting module is directly pressed on the outer frame, and then the pressure is transmitted to a worktable on which the main board is placed through the backplane to avoid the damage of the main board because the automatic CPU taking-putting module is directly pressed on the main board.
Description
【Technical Field】 [0001] The invention relates to a pressing device of a CPU automatic pick-and-place module. 【Background technique】 [0002] The computer motherboard needs to be tested before leaving the factory. The CPU needs to be installed on the CPU mounting seat on the motherboard. In the traditional testing process, people need to manually install the CPU on the motherboard and then perform the test. The existing CPU automatically picks and places the equipment. Press the entire device directly onto the motherboard and test it. This device is suitable for CPUs with low power and low computing power; however, for high-power, high-performance server and workstation CPUs, such as Intel LGA3647 server CPUs, it has 3647 CPUs. Contacts, and need to load a very large force during normal operation, and the CPU automatic pick-and-place module needs to add higher performance heat dissipation, compression, and adaptive positioning devices, which makes the entire device very heavy. If...
Claims
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Patent Timeline
Login to View More IPC IPC(8): G06F11/22B23P19/02
CPCG06F11/22G06F11/2236G06F11/2247B23P19/02Y02D10/00
Inventor 赵七星林志成
Owner ZHONGSHAN TUODIAN ELECTRONICS TECH