Single-sided reflow no-cavity method of double-sided board

A double-sided, single-sided technology, used in electrical components, printed circuit manufacturing, printed circuits, etc., can solve problems such as low production efficiency and waste of equipment, and achieve the effect of improving production efficiency

Inactive Publication Date: 2016-12-14
FLEXTRONICS ELECTRONICS TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] a. Two production lines are required, one for the reverse and the other for the

Method used

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  • Single-sided reflow no-cavity method of double-sided board
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  • Single-sided reflow no-cavity method of double-sided board

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] Embodiments of the invention include:

[0022] A double-sided single-sided reflow method without voids. During single-sided reflow, the front side of the double-sided PCB faces upward and the ball faces downward, including the following specific steps:

[0023] a. Modify the stencil opening design and adopt X-shaped stencil opening;

[0024] b. Flow soldering temperature curve setting, adopt RTS type or RSS type profile, use reflow soldering machine, a total of 10 temperature zones and 2 cooling zones, the sp...

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PUM

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Abstract

The invention discloses a single-sided reflow no-cavity method of a double-sided board. During single-sided reflow, the front side of a PCB (Printed Circuit Board) double-sided board faces upwards, and the spherical surface of the PCB double-sided board faces downwards. The method comprises the following specific steps: a: revising steel mesh trepanning design, and adopting X-shaped steel mesh trepanning; b: setting a flow soldering temperature curve, adopting RTS type or RSS type profile, and using a reflow soldering machine, wherein 10 warm areas and 2 cooling areas are jointly arranged, and speed is 30-39inch/min; c: regulating dipping time, and adopting 75-85 seconds. Through the above way, the single-sided reflow no-cavity method of the double-sided board is characterized in that double-sided reflow is changed in to single-sided reflow, two production lines are changed into one production line, and production efficiency is improved. Meanwhile, under the situation of single-sided reflow, a cavity ratio is enabled to be consistent with or approach to a double-sided reflow effect and meet an IPC (Institute Of Printed Circuits)610*standard.

Description

technical field [0001] The invention relates to the field of PCB boards, in particular to a double-sided single-sided reflow method without voids for mounting and welding surface components. Background technique [0002] PCBA board, the front side is for mounting components, the reverse side is a ball made of solder paste, no components are mounted, similar to BGA. [0003] Since the ball is made of solder paste, the solder paste contains liquid, which vaporizes and volatilizes during reflow. Due to time constraints, the gas cannot be completely volatilized, resulting in voids, which are inevitable, and BGA balls The metal particles used will not have this problem. Under normal circumstances, the single-sided reflow of double-sided panels has more voids than the double-sided reflow, because at this time the spherical surface is down, the gas volatilizes upwards, and is blocked by the PCB, resulting in poor volatilization, resulting in voids. [0004] The double-sided reflo...

Claims

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Application Information

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IPC IPC(8): H05K3/34
CPCH05K3/3494H05K2203/043
Inventor 苏进华
Owner FLEXTRONICS ELECTRONICS TECH SUZHOU
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