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Computer heat dissipation case

A chassis and computer technology, applied in the field of computers, can solve the problems of unfavorable chassis air circulation, heat cannot be quickly dissipated, rollover, etc., to achieve good heat dissipation effect, increase the amount of air inhaled from the outside, and the overall structure is simple.

Inactive Publication Date: 2016-12-21
陈玮彤
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The chassis is used to accommodate important hardware such as motherboards, hard drives, and power supplies. Its heat dissipation performance and dust-proof performance have always been the focus of attention; most of the currently used chassis are equipped with dust-proof nets at the air inlets to prevent dust. When entering, it is not conducive to the air circulation in the chassis, and the heat cannot be dissipated quickly; in addition, the height of the chassis is usually much larger than the width of the bottom, and it is easier to rollover due to collision

Method used

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  • Computer heat dissipation case

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Embodiment Construction

[0012] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, a clear and complete description will be made below in conjunction with the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, and Not all examples. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0013] The computer cooling case of preferred embodiment of the present invention is as figure 1 As shown, it includes a chassis 1 and a base 2. The base 2 is provided with a cavity 20 that is installed in cooperation with the bottom of the chassis 1; the side wall of the base 20 is provided with a plurality of through holes 21 communicating with the cavity 20; the bottom of the cavity 20 is prov...

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Abstract

The invention relates to a computer heat dissipation case, comprising a case and a base. The base is equipped with a concave cavity mounted in fit with the bottom of the base. The side wall of the base is equipped with multiple through holes communicated with the concave cavity. Multiple elastic support blocks which are distributed uniformly are arranged at the bottom of the concave cavity. The bottom of the base is equipped with a first rotation motor. The rotation end of the first rotation motor is connected with an air draft fan. The upper end in the case is equipped with a power supply and a power supply fan. A rotation shaft is arranged in the case. Fan blades are arranged on the rotation shaft. A control switch for controlling the first rotation motor to operate is arranged on the base. The computer heat dissipation case also comprises a dustproof net cover. Through adoption of the dustproof net cover, a dustproof function is realized; the power supply fan operates to suck in external air; the first rotation motor drives the air draft fan to discharge internal hot air; the first rotation motor drives the fan blades to move, so that the air flow speed in the case is increased or the air in the case moves from the top to the bottom; the heat dissipation efficiency is greatly improved; the external sucked air volume is greatly improved; and the integrated heat dissipation effect is good.

Description

technical field [0001] The invention relates to the technical field of computers, and more specifically, to a computer cooling case. Background technique [0002] The chassis is used to accommodate important hardware such as motherboards, hard drives, and power supplies. Its heat dissipation performance and dust-proof performance have always been the focus of attention; most of the currently used chassis are equipped with dust-proof nets at the air inlets to prevent dust. At the same time, it is not conducive to the air circulation in the chassis, and the heat cannot be dissipated quickly; in addition, the height of the chassis is usually much larger than the width of the bottom, and it is easier to rollover due to collision. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a computer heat dissipation chassis with good heat dissipation and dustproof effect and can effectively prevent rollover in view of the above-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20
Inventor 陈玮彤
Owner 陈玮彤
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