Halogenated flame retardant resin composition and resin products and laminates made from it

Abstract

The invention discloses a halogen-containing flame-retarded resin composition, and a resin product and a laminated board which are made by the halogen-containing flame-retarded resin composition. The halogen-containing resin composition comprises: (1) 40-80 parts by weight of vinyl or acrylate blocking modified low molecular polyphenyl ether with the number-average molar mass of 1000-3000; (2) 10-30 parts by weight of vinyl blocking bromine-containing flame retardant with the number-average molar mass of 500-6000; (3) 10-30 parts by weight of olefin low polymer. In the halogen-containing flame-retarded resin composition, acrylic acid blocking thermosetting polyphenyl ether is in free radical polymerization with the vinyl blocking bromine-containing flame retardant; the problem of precipitation caused by poor compatibility between the adding type flame retardant and the resin system is solved; when the resin composition system reaches Class VO of UL 94 fire retardant standard, the prepreg is uniform, and the resin zone of the base material is free from split-phase and precipitation of flame retardant.

Description

technical field [0001] The invention belongs to the technical field of manufacturing laminated boards (especially copper-clad boards), and in particular relates to a novel halogen-containing flame-retardant resin composition and resin products and laminated boards made of the composition. Background technique [0002] With the rapid development of global information technology towards digitization and networking, ultra-large-capacity information transmission, ultra-fast and ultra-high-density information processing have become the goals pursued by the development of information and communication equipment (ICT) technology; The heat resistance, water absorption, chemical resistance, mechanical properties, dimensional stability and dielectric properties of circuit substrates put forward higher requirements. The existing materials of epoxy resin and phenolic resin system can no longer meet the application at the present stage, especially the application of high-speed printed ci...

AI Technical Summary

Problems solved by technology

However, polyphenylene ether is a kind of thermoplastic resin, which has the following defects in the application of high-speed copper clad laminates: high melt viscosity, difficult to process and shape; poor solvent resistance, easy to cause poor adhesion of wires during the dissolution and cleaning process of the printed circuit board manufacturing process or fall off; and the melting point is close to the glass transition temperature (Tg), it is difficult to withstand the soldering operation above 250°C in the printed circuit board process

At present, some halogenated flame retardants or halogen-free phosphazenes are usually added to improve the flame retardancy of resin compositions. In order to meet the flame retardancy standard of V-0 in UL94, a relatively large amount of flame retardants must be added, and too much flame retardants must be added. The flame retardant is easy to precipitate when the flame retardant is glued, which will inevitably reduce the overall performance of the resin system such as bonding performance and heat resistance. At the same time, the addition of the flame retardant also increases the Dk and Df values ​​​​of the resin composition. Unable to meet the application of high-speed copper-clad laminates in multi-layer PCBs

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