Module shell assembly, loudspeaker module and electronic device

A speaker module and speaker technology, which is applied to sensors, loudspeakers, electrical components, etc., can solve the problems of poor sound quality, inability to significantly improve the acoustic performance of speaker modules, and limited rear cavity volume, so as to avoid deformation and improve convenience. Effects of Sex and Effectiveness

Active Publication Date: 2017-01-04
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The existing module shell basically adopts all-plastic or injection-molded steel sheet structure in plastic. In the case of a certain size, the volume of the rear cavity can only be increased by further reducing the thickness of the module shell. However, due to the The thickness of the shell should not be too thin, otherwise it will cause the box to resonate, which will lead to poor sound quality. Therefore, the volume of the rear cavity that can be increased by this method is very limited, and the acoustic performance of the speaker module cannot be significantly improved.

Method used

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  • Module shell assembly, loudspeaker module and electronic device
  • Module shell assembly, loudspeaker module and electronic device
  • Module shell assembly, loudspeaker module and electronic device

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Embodiment Construction

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless specifically stated otherwise, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0031] The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present invention and its application or use.

[0032] The technologies, methods, and equipment known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be regarded as part of the specification.

[0033] In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of th...

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Abstract

The present invention discloses a module shell assembly, a loudspeaker module and an electronic device. The assembly includes a shell assembly body and at least one expansion board combined in the shell assembly body, and each expansion board is exposed through an inner surface of the shell assembly body, wherein the expansion board is a hard board, and the expansion board is made of a porous material. A module shell of the loudspeaker module includes the module shell assembly. The electronic device includes the loudspeaker module.

Description

Technical field [0001] The present invention relates to the technical field of electroacoustic products. More specifically, the present invention relates to a module housing assembly for a speaker module, a speaker module using the module housing assembly, and a speaker module provided with the same Electronic equipment. Background technique [0002] The speaker module includes a module housing and a speaker unit installed in the module housing. In order to ensure that the speaker module has good acoustic performance, the module housing is usually required to have a larger back cavity. [0003] The existing module shell basically adopts all-plastic or injection-molded steel sheet structure in plastic. In the case of a certain size, the volume of the rear cavity can only be increased by further reducing the thickness of the module shell. However, due to the module The thickness of the shell should not be too thin, otherwise it will cause the cabinet to resonate and result in poor s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R9/06H04R9/02
CPCH04R9/02H04R9/06H04R2400/11
Inventor 刘岩涛王召鑫
Owner GOERTEK INC
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