Module housing components, speaker modules and electronic equipment

A speaker module and speaker technology, which is applied to sensors, loudspeakers, electrical components, etc., can solve the problems of poor sound quality, inability to significantly improve the acoustic performance of speaker modules, and limited rear cavity volume, so as to avoid deformation and improve convenience. Effects of Sex and Effectiveness

Active Publication Date: 2020-03-17
GOERTEK INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The existing module shell basically adopts all-plastic or injection-molded steel sheet structure in plastic. In the case of a certain size, the volume of the rear cavity can only be increased by further reducing the thickness of the module shell. However, due to the The thickness of the shell should not be too thin, otherwise it will cause the box to resonate, which will lead to poor sound quality. Therefore, the volume of the rear cavity that can be increased by this method is very limited, and the acoustic performance of the speaker module cannot be significantly improved.

Method used

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  • Module housing components, speaker modules and electronic equipment
  • Module housing components, speaker modules and electronic equipment
  • Module housing components, speaker modules and electronic equipment

Examples

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Embodiment Construction

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0031] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0032] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0033] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The present invention discloses a module shell assembly, a loudspeaker module and an electronic device. The assembly includes a shell assembly body and at least one expansion board combined in the shell assembly body, and each expansion board is exposed through an inner surface of the shell assembly body, wherein the expansion board is a hard board, and the expansion board is made of a porous material. A module shell of the loudspeaker module includes the module shell assembly. The electronic device includes the loudspeaker module.

Description

technical field [0001] The present invention relates to the technical field of electro-acoustic products, more specifically, the present invention relates to a module shell assembly for a speaker module, a speaker module using the module shell assembly, and a speaker module provided with the speaker module Electronic equipment. Background technique [0002] The speaker module includes a module casing and a speaker unit installed in the module casing. In order to ensure that the speaker module has good acoustic performance, the module casing is usually required to have a larger rear cavity. [0003] The existing module shell basically adopts all-plastic or injection-molded steel sheet structure in plastic. In the case of a certain size, the volume of the rear cavity can only be increased by further reducing the thickness of the module shell. However, due to the The thickness of the shell should not be too thin, otherwise it will cause the box to resonate, resulting in poor s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R9/06H04R9/02
CPCH04R9/02H04R9/06H04R2400/11
Inventor 刘岩涛王召鑫
Owner GOERTEK INC
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