A kind of high-temperature electrothermal film and its preparation method
An electrothermal film and high-temperature technology, applied in the field of high-temperature electrothermal film and its preparation, can solve the problems of complex process steps, damage, uneven heating, etc., achieve high electrothermal radiation conversion efficiency, high temperature uniformity, and simplify the process flow
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Embodiment 1
[0059] 1. Die-cut a graphite film with a thickness of 25 μm and a size of 14 cm×8.5 cm figure 1 In the pattern shown, the graphite film is made of graphene powder, the width of the graphite heating element is 0.55cm, the total length is 149.2cm, and the square resistance is 0.1Ω / □;
[0060] 2. Lay the die-cut graphite film on the PI film with a thickness of 125 μm and a size of 14 cm×8.5 cm. There is 50 μm thick silica gel on the PI film;
[0061]3. Use laser cutting equipment to cut 2 holes with a diameter of 0.55cm on the PI film with a thickness of 125μm, and the size of the PI film is 14cm×8.5cm;
[0062] 4. Align the PI film with the hole cut and the PI film covered with the graphite film heating element and then stick them together, so that the graphite heating element is partially exposed for subsequent crimping of the terminal;
[0063] After the terminal is pressed, the resistance of the graphite film electric heating film is measured to be 27Ω. At a room temperature...
Embodiment 2
[0065] 1. Die-cut a graphite film with silica gel with a thickness of 25 μm and a size of 14 cm×10.8 cm figure 2 In the pattern shown, the graphite film is sintered by PI film, the width of the graphite heating element is 0.55cm, the total length is 165.7cm, and the square resistance is 0.1Ω / □;
[0066] 2. Lay the die-cut graphite film on the PI film with a thickness of 125μm and a size of 14cm×10.8cm;
[0067] 3. Use laser cutting equipment to cut 2 holes with a diameter of 0.55 cm on the PI film with a thickness of 125 μm. There is silica gel with a thickness of 100 μm on the PI film, and the size of the PI film is 14 cm×10.8 cm;
[0068] 4. Align the PI film with the hole cut and the PI film covered with the graphite film heating element and then stick them together, so that the graphite heating element is partially exposed for subsequent crimping of the terminal;
[0069] 5. Cut the bonded electric heating film with a laser cutting machine figure 2 the shape shown.
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