Camera module manufacturing method and terminal handling equipment

A technology of a camera module and a manufacturing method, which is applied in the directions of image communication, radiation control device, and components of color TV, etc., can solve the problems of generating thermal noise, affecting the yield rate, increasing the height of the camera module, etc., so as to relieve pressure, Avoid height increase, improve image quality effects

Pending Publication Date: 2017-01-11
GALAXYCORE SHANGHAI
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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for manufacturing a camera module and terminal processing equipment, so as to solve the technical pro

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  • Camera module manufacturing method and terminal handling equipment
  • Camera module manufacturing method and terminal handling equipment
  • Camera module manufacturing method and terminal handling equipment

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Embodiment Construction

[0031] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar extensions without violating the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0032] Secondly, the present invention is described in detail by means of schematic diagrams. When describing the embodiments of the present invention in detail, for convenience of explanation, the schematic diagrams are only examples, which should not limit the protection scope of the present invention.

[0033] In order to solve the problems in the background technology, the present invention provides a method for manufacturing a camera module and a terminal processing device. The camera module includes a co-processing chi...

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Abstract

The invention provides a camera module manufacturing method and terminal handling equipment. The camera module manufacturing method includes that a camera, a flexible printed circuit board, an assist processing chip and a connector are provided, and the assist processing chip and the connector are respectively located on the front side and the reverse side corresponding to the flexible printed circuit board; an image sensor chip of the camera transmits an original image signal to the assist processing chip, and the original image signal is transmitted to the terminal processing equipment after processed through the assist processing chip. An image signal processing chip receives a processed image, pressure of the image signal processing chip on image processing is alleviated, and image quality is improved; in addition, the assist processing chip is arranged in a stiffening plate, height increase of a camera module due to the assist processing chip is avoided, and performance of the image sensor chip is unaffected due to heating of the assist processing chip.

Description

technical field [0001] The present invention relates to the technical field of camera modules, in particular to a method for manufacturing a camera module and terminal processing equipment. Background technique [0002] Image signal processing (Image Signal Process, ISP) technology is a commonly used camera processing technology, which is to post-process the image data output from the image sensor according to the requirements of human vision. With the continuous improvement of camera pixels, the requirements for image processing capabilities in the later stage are also getting higher and higher. Low-pixel image sensors have their own ISP processing unit, while high-pixel image sensors generally use a Raw format output plus platform ISP solution. However, limited by the transmission bandwidth of the camera module and the ISP chip, the high-end image sensor will also have a built-in ISP to preprocess and compress the image to alleviate the bandwidth problem and the pressure ...

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Application Information

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IPC IPC(8): H01L27/146H04N5/225
CPCH01L27/146H01L27/14601H01L27/14634H01L27/14683H01L27/14687H01L27/1469H04N23/50
Inventor 张黎黎杨慎杰程亦隆
Owner GALAXYCORE SHANGHAI
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