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A method for preparing a surface-attached electrode array

An electrode array and attaching technology, applied in the field of micro-electrodes, can solve the problems of thick electrode array, large mass, complicated preparation process, etc.

Active Publication Date: 2019-12-20
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The commonly used electrode type is the electrode array attached to the cerebral cortex. The main preparation method is silicone rubber curing and molding. The electrode array is prone to displacement during the process, which may damage the brain tissue or cause a decrease in the quality of the recorded signal

Method used

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  • A method for preparing a surface-attached electrode array
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preparation example Construction

[0039] see figure 1 , figure 1 It is a schematic flowchart of a method for preparing a surface-attached electrode array provided by an embodiment of the present invention. Please also refer to Figures 2A-2C , Figures 2A-2C It is a cross-sectional view of each manufacturing process of a surface-mounted electrode array provided by an embodiment of the present invention. The preparation method of the surface-attached electrode array includes:

[0040] Step S101: Provide a bottom substrate 210; please refer to Figure 2A .

[0041] Specifically, the bottom substrate 210 can be made of a high molecular polymer material, such as a silicon rubber film, by cutting, or printed and cut from a high molecular polymer material, which can play the role of insulation and support.

[0042] In the embodiment of the present invention, step S101 may include: according to the model of the surface-attached electrode array, using 3D printing technology to spray a second material to form the...

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Abstract

The invention provides a preparation method for a surface adhesive electrode array substrate. The method comprises the steps of providing a bottom matrix; spraying a first material to the bottom matrix by adopting a 3D printing technology according to a model of a surface adhesive electrode array to form a conductive layer; forming a patterned surface matrix on the conductive layer to enable the conductive layer to be partially exposed; and forming an electrode point used for acquiring or transmitting an electric signal. Through the 3D printing technology, the preparation of the conductive layer in the surface adhesive electrode array is realized; and the process is simple, so that the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of microelectrodes, in particular to a method for preparing a surface-attached electrode array. Background technique [0002] Epilepsy is a chronic disease of transient brain dysfunction caused by sudden abnormal discharge of brain neurons. According to the latest data provided by the World Health Organization (WHO), there are currently about 60 million epilepsy patients in the world, of which nearly 10 million are in my country. Due to its frequent and unpredictable attacks, it not only seriously affects the daily life, study and work of patients, but may even endanger their lives, bringing a great burden to patients, families and society. [0003] At present, the main treatment for epilepsy is to use antiepileptic drugs to prevent the clinical seizures of epilepsy, and its mechanism of action is mainly the inhibition of neuronal ion channels. Although traditional antiepileptic drug therapy has a certain ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61B5/04B33Y10/00B33Y50/00
CPCA61B2562/0209A61B5/24B33Y10/00B33Y50/00
Inventor 鲁艺钟成王璐璐都展宏屠洁杨帆王立平
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI