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A processing method and structure of an ultra-thin coreless packaging substrate

A technology for packaging substrates and processing methods, which is applied in the manufacture of electrical components, electrical solid devices, semiconductors/solid devices, etc., can solve the problems of insufficient strength of ultra-thin coreless packaging substrates, easy deformation and warping, product breakage, etc., to achieve Easy to process, avoid deformation and warping, and easy to transport

Active Publication Date: 2018-08-21
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Embodiments of the present invention provide a processing method of an ultra-thin coreless packaging substrate and a structure of an ultra-thin coreless packaging substrate to help solve the problem of insufficient strength of the ultra-thin coreless packaging substrate in the prior art, which is easily deformed and warped. Product damage and other issues

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  • A processing method and structure of an ultra-thin coreless packaging substrate
  • A processing method and structure of an ultra-thin coreless packaging substrate
  • A processing method and structure of an ultra-thin coreless packaging substrate

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Embodiment 1

[0023] Please refer to figure 1 The embodiment of the present invention provides a processing method of an ultra-thin coreless packaging substrate, which is applied in the field of packaging substrates, including but not limited to the field of integrated circuit packaging such as memory modules and micro-electromechanical systems. The method of the embodiment of the present invention helps to improve the processing ability of coreless packaging substrate products, and can be used to solve the processing of coreless packaging substrate products with a thickness of more than 100 μm, and can be especially used for processing coreless packaging substrate products below 100 μm. To reduce product damage, improve product yield, and meet the demand for mass production.

[0024] Please refer to figure 1 , The method of the embodiment of the present invention may include:

[0025] 101. Provide a carrier board, the carrier board includes a central dielectric layer and a composite copper foil...

Embodiment 2

[0075] Please refer to Figure 2l The second embodiment of the present invention also provides an ultra-thin coreless packaging substrate structure, which can be processed by the method of the first embodiment of the present invention.

[0076] Such as Figure 2l , Ultra-thin coreless packaging substrate structure can include:

[0077] An ultra-thin coreless packaging substrate 30, and a support plate 40 bonded to the ultra-thin coreless packaging substrate;

[0078] The coreless package substrate 30 includes an insulating layer 302, and a first circuit layer 301 and a second circuit layer 305 disposed on both sides of the insulating layer. The second circuit layer 305 and the first circuit layer 301 are electrically connected. Hole 304 is electrically connected;

[0079] The first circuit layer 301 is an embedded circuit buried in the insulating layer 302;

[0080] The supporting plate 40 is located on the side where the second circuit layer 305 is located.

[0081] Optionally, the sup...

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Abstract

The invention provides a processing method of an ultrathin coreless package substrate. The method comprises the steps as follows: a bearing plate comprising a composite copper foil layer is provided, wherein the composite copper foil layer comprises separable support base layer and an ultrathin copper foil layer; a first line layer is manufactured on the ultrathin copper foil layer, and an insulating layer and an outer copper foil layer are laminated; a via hole is manufactured, a second line layer is manufactured on the outer copper foil layer and is electrically connected with the first line layer through the via hole; resistance welding and surface coating treatment are carried out on the second line layer; the ultrathin copper foil layer is separated from the support base layer and a support plate is bonded on the obtained ultrathin coreless package substrate; the ultrathin copper foil layer is removed by micro-etching and the first line layer is exposed; and resistance welding and surface coating treatment are carried out on the first line layer. The embodiment of the invention further provides a corresponding ultrathin coreless package substrate structure. By using the protecting and strengthening effects of the support plate, the ultrathin coreless package substrate structure is conducive to solving the problems of product breakage and the like due to the fact that the ultrathin coreless package substrate easily deforms and warps due to insufficient strength in the prior art.

Description

[0001] This application claims the priority of a Chinese patent application filed with the Chinese Patent Office on July 22, 2016, the application number is 201610589560.4, and the invention title is "a processing method and structure of an ultra-thin coreless packaging substrate", the entire content of which is approved The reference is incorporated in this application. Technical field [0002] The invention relates to the technical field of packaging substrates, in particular to a processing method and structure of an ultra-thin coreless packaging substrate. Background technique [0003] The thinning of electronic products has given birth to coreless packaging substrates, which are not only thinner than core packaging substrates, but also have superior electrical performance. Unlike the core package substrate, the coreless package substrate does not include a supporting core board, and only uses an insulating layer and a copper foil layer to achieve high-density wiring through a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/14H01L23/498
Inventor 郑仰存李飒谷新李俊
Owner SHENNAN CIRCUITS
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