A chipless laser selective melting compound milling protection device and control method

Abstract

The invention discloses a chipless laser selective melting compound milling protection device and a control method, which are used in laser selective melting forming equipment. A gas circulation system for timely removal of generated debris; the gas circulation system of the milling device includes: an air intake pipe, an exhaust pipe, a gas filter, an air pump, a gas circulation device, a protective gas cylinder, an air pressure valve, and a molding chamber; The milling device is located in the molding chamber, including: a sleeve, a milling cutter, an air inlet, and an exhaust hole. The present invention removes the debris during the milling process in time through the gas circulation system to prevent it from polluting the powder bed powder. During surface milling, the side powder is removed to prevent the side surface powder from disturbing the milling, thereby effectively improving the quality and performance of the laser selective melting molding and reducing the probability of internal defects.

Description

technical field [0001] The invention relates to the research field of laser selective melting forming, in particular to a chipless laser selective melting composite milling protection device and a control method. Background technique [0002] With the development of science and technology, there are various methods for surface treatment of metal parts. Among them, milling metal parts is a common surface treatment method for metal parts. It has high processing efficiency and can obtain excellent surface quality. However, it is easy to produce more fine chips, and is currently widely used in metal processing and manufacturing. [0003] Selective laser melting is a rapid prototyping method developed on the basis of selective laser sintering. Laser selective melting molding technology has played an increasingly important role in the mechanical processing industry, because it can process parts with complex shapes that cannot be formed by traditional processing methods, so it has...

AI Technical Summary

Problems solved by technology

It is impossible to process the parts during molding, so defects such as cracks, uneven density, and poor molding surface quality are prone to occur inside the molded parts

[0004] Therefore, it is necessary to study a method of processing the part forming level in the process of laser selective melting and forming parts, which can avoid the disadvantage of more fine chips polluting the powder in the laser selective melting and forming powder bed during the milling process, and can also avoid During the side milling process of the formed part, the powder accumulated on the side surface of the part disturbs the milling tool, which makes the quality and performance of the laser selective melting forming part better

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