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Adhesive remover and adhesive removing method of adhesive remover

A glue and adhesive technology, applied in chemical instruments and methods, detergent compositions, non-surface active cleaning solvents, etc., can solve problems such as increasing labor costs, and achieve the effect of reducing overflow phenomenon and slowing down volatilization

Inactive Publication Date: 2017-03-01
正一特殊材料材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This undoubtedly increases the labor cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] In this embodiment, the adhesive remover is composed of 60% by weight of ethanol, 33% by weight of xylene and 7% by weight of polyvinyl butyral.

Embodiment 2

[0017] In this embodiment, the adhesive remover is composed of 60% by weight of ethanol, 25% by weight of n-octane and 15% by weight of alcohol-soluble acrylic resin.

Embodiment 3

[0019] In this embodiment, the adhesive remover is composed of 80% by weight of isobutanol, 15% by weight of Isopar G (standard model in the chemical industry) and 5% by weight of polyvinyl butyral.

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PUM

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Abstract

An adhesive remover is used for removing an adhesive on the surface of a base material. The adhesive remover comprises, by weight, 10-80 parts of a first solvent, 10-50 parts of a second solvent and 1-30 parts of a macromolecular compound. The first solvent is volatile and has faster volatilization speed than the second solvent. The second solvent has capability of removing an adhesive. The macromolecular compound is dissolved in the first solvent but is insoluble in the second solvent. The invention also provides an adhesive removing method using the above adhesive remover.

Description

technical field [0001] The invention relates to a glue removing agent and a glue removing method using the glue remover. Background technique [0002] In recent years, in the production or assembly process of 3C products (such as mobile phones, tablet computers or notebook computers, etc.), various adhesives are often coated on electronic components to achieve functions such as adhesion, shielding, protection, insulation, and rust prevention. . However, if the product needs to be reprocessed in case of defective products during the production or assembly process, it is usually necessary to use an adhesive remover to completely remove the adhesive from the electronic components. However, it is difficult to completely remove the cured residual adhesive. [0003] At present, the common adhesive remover is usually in liquid state, and when it is applied on the electronic components to remove the adhesive, it is easy to overflow and pollute other electronic components. In orde...

Claims

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Application Information

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IPC IPC(8): C11D7/26C11D7/24C11D7/50C11D7/60
Inventor 郭俊宏
Owner 正一特殊材料材料股份有限公司