Method for soldering an insulating substrate to a carrier
A technology of insulating substrates and insulating carriers, which can be used in welding equipment, welding/welding/cutting items, electric solid devices, etc., and can solve disadvantages and other problems
Active Publication Date: 2019-10-29
INFINEON TECH AG
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Problems solved by technology
This results in localized thermal transition resistances between the insulating substrate and the carrier, which is disadvantageous when the operating heat raised in the power semiconductor chip is conveyed to the carrier via the insulating substrate and the solder
[0003] As soon as a solder layer with a very inhomogeneous thickness distribution is considered unfavorable for a particular structure, an inspection by Roentgen ray technology is required after the production of the solder layer, which is often associated with great expenditure
Method used
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[0014] figure 1 A cross-sectional view of the carrier 3 and the insulating substrate 2 soldered on the carrier is shown. The carrier 3 can, for example, have a planar or approximately planar design. The carrier 3 has an upper side 3t with a substrate mounting section 32, on which the insulating substrate 2 is later soldered.
[0015] Smaller or larger values are also possible for the thickness of the carrier 3 , for example, in the region of 2 mm to 5 mm. The carrier 3 can consist, for example, of metal or of a metal-matrix-composite material (MMC-Material). Suitable materials for the carrier 3 made of metal are, for example, copper, copper alloys, aluminum or aluminum alloys. Likewise, the carrier 3 can have, for example, a carrier layer of copper, a copper alloy, aluminum or an aluminum alloy, or another material. For better solderability, the carrier layer is provided with a thin coating which forms the side of the substrate mounting section 32 facing away from the ca...
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Abstract
The invention relates to a method for soldering an insulating substrate (2) to a substrate mounting section (32) of a carrier (3) by means of a predetermined solder (4), wherein the insulating substrate (2) has A dielectric insulating carrier (20), an upper side (2t) and a lower side (2b) opposite the upper side (2t). In this method the insulating substrate (2) is selected according to a criterion which infers that the insulating substrate (2) has a positive non- Uniformity (UE2). Solder the selected insulating substrate (2) with the substrate mounting section (32) at the underside (2b) of the insulating substrate (2) so that the solidified solder (4) penetrates from the The lower side (2b) of the insulating substrate (2) extends to the substrate mounting section (32); before or after soldering, at least one semiconductor chip (1) is mounted on the upper side (2t) of the insulating substrate (2) .
Description
technical field [0001] The invention relates to a method for soldering an insulating substrate to a carrier. Background technique [0002] Insulating substrates are often used as circuit carriers for electrical circuits and are soldered to the carrier by means of large-area solder connections, for example, for the production of power semiconductor modules. Generally, insulating substrates are joined by two or more components. Depending on the joining process involved and the (often different) thermal expansion coefficients of the components, the circuit carrier can have a temperature-dependent curvature that is difficult to predict in advance. Two substrates that are constructed identically, when they are assumed to have been produced according to the same production method with the same process parameters and should therefore exhibit essentially the same temperature-dependent curvature behavior, can however themselves later also exhibit different Temperature-dependent cur...
Claims
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IPC IPC(8): H01L21/02H01L21/3105
CPCH01L21/02109H01L21/3105H01L2924/00014B23K2101/40B23K1/0016H01L21/4882H01L23/3735H01L2224/48227H01L2224/48472H01L2224/05599H01L2224/45099H01L2224/85399B23K2103/12B23K2103/18B23K2103/52B23K1/19H01L24/48H01L24/85H01L2224/85205H01L2924/1203H01L2924/1301H01L2924/13055H01L2924/13062H01L2924/13091H01L2924/3511
Inventor C·兰贝尔-里维埃J-L·德波尔德M·哈勒尔N·A·扎纳特拉V·瓦托罗梅
Owner INFINEON TECH AG