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Integrity detection method and apparatus used for chip top metal protective coating

A technology of integrity detection and top metal, which is applied to record carriers, instruments, computer parts, etc. used in machines to achieve high sensitivity and improve the level of safety protection.

Active Publication Date: 2017-03-15
TIANJIN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] After patent retrieval, the Chinese patent CN103646137A has proposed a simple top metal protective layer structure [2] , but no Chinese patent has proposed a related integrity detection method

Method used

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  • Integrity detection method and apparatus used for chip top metal protective coating
  • Integrity detection method and apparatus used for chip top metal protective coating
  • Integrity detection method and apparatus used for chip top metal protective coating

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Embodiment Construction

[0020] The present invention provides a method for detecting the integrity of the top metal protection layer. The detection method is suitable for the top metal protection layer of a variety of graphic topological structures. The present invention will take a spiral topology as an example to illustrate the integrity detection method. .

[0021] Such as figure 2 Shown is the wiring diagram of the top metal protective layer of the general spiral topology. The protective layer is composed of metal wires AB. Among them, port A is a detection signal input port, and port B is a detection signal output port. During the integrity test, the signal is detected at the B port to determine whether it is consistent with the signal input to the A port. If they are consistent, it is considered that they have not been attacked and the protective layer is complete; if they are inconsistent, they are considered attacked and the protective layer is destroyed. A commonly used detection signal is ...

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Abstract

The invention relates to the field of chip security, and brings forward an integrity detection method suitable for a top metal protective coating. By use of the method, whether a metal wire of the protective coating is complete can be detected in real time, and accordingly, whether an attacker lunches a short-circuit or circuit-break attack on the protective coating by use of an FIB is determined. At the same time, the method can be applied to multiple wiring layer figure topology structures, enhances the detection sensitivity of the metal protective coating and improves the security protection level. The technical scheme is as follows: by use of the integrity detection method of the chip top metal protective coating, a spiral topology structure top metal protective coating wire, i.e., a metal wire AB is broken into four metal wires which are respectively a metal wire AC, a metal wire DH, a metal wire BE and a metal wire FG, each metal wire represents a sub protective coating, and all together, there are four sub protective coatings. The method and apparatus are mainly applied to a chip security occasion.

Description

Technical field [0001] The invention relates to the field of chip security, in particular to a method and device for detecting the integrity of a metal protective layer on the top layer of a chip. Background technique [0002] With the advancement of attack technology, there are more and more invasive attacks on chips. By cracking the chip package, and then using focused ion beam (Focused Ion beam, FIB), micro probes and other means for analysis and extraction, it can be easily obtained Sensitive information and circuit structure of the chip. Focused ion beam attack, as a very effective intrusive attack method, poses a serious threat to the data security of the chip [1] . [0003] For focused ion beam attacks, the existing defense methods mainly use a top metal protective layer. Such as figure 1 As shown, the top metal protection layer uses one or more layers of metal traces to shield the devices and connections under the metal layer and hide the key circuits below; at the same t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/073
CPCG06K19/07363
Inventor 赵毅强辛睿山王佳李跃辉赵公元
Owner TIANJIN UNIV
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