A temperature measuring device for rapid heat treatment equipment
A rapid heat treatment and temperature measurement technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems such as temperature measurement errors, achieve the effects of reducing influence, avoiding emissivity differences, and accurate measurement results
Active Publication Date: 2019-04-05
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
View PDF3 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, infrared temperature measurement is affected by the emissivity of the measured object. When the emissivity of the measured object is inconsistent with the emissivity of the calibration object, it will lead to a large temperature measurement error, ensuring the temperature stability of the RTP device during the rapid heating and cooling process. Accurate measurement has become a technical difficulty
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0018] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0019] Such as figure 1 and figure 2 As shown, the temperature measurement device for rapid heat treatment equipment in this embodiment includes a temperature measurement infrared probe assembly 1, an emissivity measurement probe 2, a mount 3 and a reflector 4, the reflector 4 is located above the mount 3, and the temperature measurement The infrared probe assembly 1 and the emissivity measurement probe 2 are installed on the mount 3, the temperature measurement infrared probe assembly 1 passes through the reflector 4, the reflector 4 is provided with a through hole 41, and the emissivity measurement probe 2 is located below the through hole 41, The temperature measurement device for rapid heat treatment equipment uses the temperature measurement infrared probe assembly 1 to measure the temperature of the measured object 6, uses the...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a temperature measuring device used for rapid heat treatment equipment. The temperature measuring device comprises a temperature measuring infrared probe assembly, an emissivity measuring probe, a mounting base and a reflector plate, wherein the reflector plate is positioned above the mounting base; the temperature measuring infrared probe assembly and the emissivity measuring probe are arranged on the mounting base; the temperature measuring infrared probe assembly passes through the reflector plate; a through hole is formed in the reflector plate; and the emissivity measuring probe is positioned under the through hole. The temperature measuring device has the advantages that the structure is simple and reliable, the device is not influenced by the emissivity difference of measured objects, and the temperature measurement is accurate.
Description
technical field [0001] The invention relates to rapid heat treatment equipment for semiconductor manufacturing process, in particular to a temperature measuring device for rapid heat treatment equipment. Background technique [0002] Rapid thermal processing (hereinafter referred to as RTP) process is to reduce the thermal budget of the process by shortening the time that the wafer stays in the thermal field by rapidly raising the temperature. RTP technology was originally developed for the annealing process after ion implantation, but due to its very fast heating and cooling The advantages of high speed, shorter process time and smaller cavity volume have been widely used in advanced semiconductor manufacturing processes, and have become the mainstream technology for deep submicron semiconductor wafer heat treatment processes. It is used for ultra-shallow junction advanced The advantages of device and large-size wafer manufacturing process are more obvious. The key applicat...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67248
Inventor 钟新华袁卫华龙会跃金则军易文杰胡振东
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP