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Intelligent container truck for chip packaging

A chip packaging and transport vehicle technology, applied in transportation and packaging, motor vehicles, two-dimensional position/channel control, etc., can solve problems such as labor consumption and errors, reduce labor intensity, facilitate use, and improve production safety factor Effect

Inactive Publication Date: 2017-03-22
JIANGSU ZHISHI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method of manual loading and unloading and transportation not only consumes manpower, but is also prone to human errors and has certain risks.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] Embodiments of the present invention are described in detail below, and the described embodiments are exemplary, and are only used to explain the present invention, but not to limit the present invention.

[0020] Those skilled in the art will understand that unless otherwise stated, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the word "comprising" used in the description of the present invention refers to the presence of said features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, Integers, steps, operations, elements, components, and / or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Additionally, "connected" or "cou...

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PUM

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Abstract

The invention discloses an intelligent container truck for chip packaging. The intelligent container truck comprises a truck body and a nitrogen cabinet arranged on the truck. The truck body is provided with a travel control module, an information acquisition module, an information processing module, a camera, a wireless transmission module and a controller. The controller is connected with the travel control module, the information acquisition module, the information processing module, the camera and the wireless transmission module. The information acquisition module is connected with the information processing module.

Description

technical field [0001] The invention relates to an intelligent material box transport vehicle for chip packaging. Background technique [0002] The material box is made of aluminum alloy, which is suitable for automatic die bonding machine, automatic wire bonding machine and other machines. Cartridges have different usage methods and materials in different industries. In the packaging industry, aluminum boxes are generally used for packaging and baking operations. It is mainly used in automatic die bonding machine, automatic wire bonding machine (ASM, KS, KAIJO) and other machines for automatic loading and unloading. There are mainly in-line material boxes, SMD material boxes, high-power material boxes, COB material boxes, triode material boxes and various non-standard material boxes. [0003] In semiconductor packaging, the semiconductor production process consists of wafer fabrication, wafer testing, chip packaging, and post-package testing. After plastic sealing, a se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05D1/02
CPCG05D1/024G05D1/0246
Inventor 范磊
Owner JIANGSU ZHISHI TECH CO LTD
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