Rigid-flexible combination board and manufacturing method thereof

A technology of rigid-flex boards and manufacturing methods, which is applied in the directions of multilayer circuit manufacturing, printed circuit manufacturing, conductive pattern layout details, etc., can solve the problems of difficulty in uncovering, small uncovering area, and low production efficiency, and achieve the goal of solving the problems of manufacturing inefficient effect

Active Publication Date: 2017-03-22
SHENZHEN KINWONG ELECTRONICS
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0005] In view of the above deficiencies in the prior art, the purpose of the present invention is to provide a rigid-flexible board and its manufacturing method, aiming to solve the problems of low production efficiency, small uncovering area and difficulty in uncovering the existing rigid-flexible board using a single method. question

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  • Rigid-flexible combination board and manufacturing method thereof
  • Rigid-flexible combination board and manufacturing method thereof

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Embodiment Construction

[0024] The present invention provides a rigid-flex board and its manufacturing method. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0025] see figure 1 , figure 1 It is a flow chart of a preferred embodiment of a method for manufacturing a rigid-flexible board of the present invention, as shown in the figure, which includes steps:

[0026] S1. Pre-open blind grooves in the first area of ​​the rigid board of the rigid-flex board, and pre-open the window area in the second area of ​​the rigid board of the rigid-flex board, wherein the first area of ​​the rigid board corresponds to the middle flex of the rigid-flex board The area of ​​the flexible board that contains fingers or pads, and the second are...

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Abstract

The invention discloses a rigid-flexible combination board and a manufacturing method thereof. The manufacturing method comprises the steps of A, pre-forming a blind groove in a first region of a rigid board of the rigid-flexible combination board, and pre-forming a windowing area in a second region of the rigid board of the rigid-flexible combination board at the same time, wherein the first region of the rigid board corresponds to a region, which contains a finger or a bonding pad, of a flexible board in the rigid-flexible combination board, and the second region of the rigid board corresponds to a region, which does not contain a finger and a bonding pad, of the flexible board in the rigid-flexible combination board; B, performing lamination processing on the rigid board and the flexible board of the rigid-flexible combination board; and C, performing routing at the position of the pre-formed blind groove of the rigid board, and exposing the finger or the bonding pad after uncovering. According to the invention, two manufacturing methods such as an uncovering method and a windowing method are simultaneously applied to products containing a finger or a bonding pad and products without a finger or a bonding pad. The manufacturing method can solve problems that an uncovering region is too small and that uncovering is difficult to be performed. Meanwhile, the manufacturing method can solve a problem that a single method is low in manufacturing efficiency.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a rigid-flex board and a manufacturing method thereof. Background technique [0002] At present, rigid-flex boards are mostly made by two methods: the uncovering method and the windowing method. In terms of product design subdivision, it can be divided into two categories. Category I is: products with no fingers or pads in the flexed area of ​​the finished product (that is, no copper exposed on the exposed flexed area); Type II: products with fingers in the flexed area of ​​the finished product. or pads (that is, exposed flex areas with exposed copper) products. The window-opening method can only be used in the production of Class I products, and the uncovering method can be used in the production of Class I and Class II products. The advantages and disadvantages of these two production methods are as follows: the window-opening method saves the pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/46
CPCH05K1/0298H05K3/4611H05K3/4691
Inventor 易康志侯利娟马奕
Owner SHENZHEN KINWONG ELECTRONICS
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