The invention provides a film-expanding grain-eliminating method of a
wafer and a
wafer production method, wherein the film-expanding grain-eliminating method and the
wafer production method relate to the technical field of
semiconductor wafer
processing. The film-expanding grain-eliminating method comprises the following steps of (a), supplying a wafer and
cutting the wafer into a plurality of
crystal grains which adhere a bottom film; (b), performing expansion on the bottom film on which the plurality of
crystal grains are adhered, and eliminating the unqualified grain particles; and (c), baking the bottom film for restoring the bottom film to a state before film expansion. The film-expanding grain-eliminating method settles technical problems of edge breaking and scratch of adjacent
crystal grains, severe crystal
grain quality reduction and incapability of normally performing subsequent processes caused by mutual collision between the unqualified crystal grains and the adjacent crystal grains in an unqualified crystal grain eliminating process after the wafer is
cut into crystal grains by a wafer manufacturer. Distance increase between the crystal grains is realized through film expansion so that the unqualified crystal grains do not collide with adjacent crystal grains in the eliminating process, thereby realizing technical effects of ensuring high crystal
grain quality and facilitating subsequent normal execution of a subsequent packaging process.