Cyanogen-free preplated
copper solution belongs to the technical field of surface treatment
electroplating. The solution adopts a nontoxic organic
phosphine compound to replace
cyanide as a complexing agent for the preplated
copper, and is particularly suitable for preplated
copper used to electroplate steel, aluminum,
magnesium,
zinc,
titanium and
titanium alloy. The
cyanogen-free preplated copper solution has the following main technical characteristic that the solution consists of (a) one sort of copper sulphate,
basic cupric carbonate or
copper nitrate with the
volume concentration of between 30 and 60 g / L; (b) one sort or two sorts of compounds selected from
methylene diphosphonic acid, 1-hydroxyethylidene 1.1 diphosphonic acid and 1-hydroxybutyleneidene 1.1 diphosphonic acid with the
volume concentration of between 120 and 160 g / L; (c) one sort or two sorts of compounds selected from methylamino dimethylene diphosphonic acid, hexamethylene
diamine tetramethylene phosphonic acid and
ethylenediamine tetramethylene phosphonic acid with the
volume concentration of between 2 and 5 g / L; (d) one sort of
potassium citrate, amine citrate or
seignette salt with the volume concentration of between 6 and 12 g / L, and (e) polyethyleneimine
alkyl slat or
aliphatic amine ethoxy sulfonated substance (AESS) with the volume concentration of between 0.02 and 0.05 g / L. The
cyanogen-free preplated copper solution has the characteristics of stable service performance, simple solution compositions, convenient maintenance, high safety,
environmental protection, reliable plating coat binding and the like.