Film-expanding grain-eliminating method of wafer and wafer production method

Abstract

The invention provides a film-expanding grain-eliminating method of a wafer and a wafer production method, wherein the film-expanding grain-eliminating method and the wafer production method relate to the technical field of semiconductor wafer processing. The film-expanding grain-eliminating method comprises the following steps of (a), supplying a wafer and cutting the wafer into a plurality of crystal grains which adhere a bottom film; (b), performing expansion on the bottom film on which the plurality of crystal grains are adhered, and eliminating the unqualified grain particles; and (c), baking the bottom film for restoring the bottom film to a state before film expansion. The film-expanding grain-eliminating method settles technical problems of edge breaking and scratch of adjacent crystal grains, severe crystal grain quality reduction and incapability of normally performing subsequent processes caused by mutual collision between the unqualified crystal grains and the adjacent crystal grains in an unqualified crystal grain eliminating process after the wafer is cut into crystal grains by a wafer manufacturer. Distance increase between the crystal grains is realized through film expansion so that the unqualified crystal grains do not collide with adjacent crystal grains in the eliminating process, thereby realizing technical effects of ensuring high crystal grain quality and facilitating subsequent normal execution of a subsequent packaging process.

Description

technical field [0001] The invention relates to the technical field of semiconductor wafer processing, in particular to a wafer film expanding and grain-taking method and a wafer production method. Background technique [0002] In recent years, with the rapid development of the optoelectronic industry, the demand for highly integrated and high-performance semiconductor wafers has also increased. In order to greatly save costs and improve manufacturing efficiency, integrated circuits are often deposited on wafers in mass production. The chip or circuit element structure is then divided into individual crystal grains, and finally packaged and soldered. Therefore, the packaging efficiency of the crystal grains has an important impact on improving the production efficiency of the wafer. [0003] When traditional dies are packaged, the dies need to be sorted first, and the unqualified dies can be removed before packaging, resulting in low packaging efficiency. In order to improv...

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Problems solved by technology

[0003] When the traditional die is packaged, it is necessary to sort the die first, and then remove the unqualified die before packaging, resulting in low packaging efficiency

In order to improve the packaging efficiency, some wafer manufacturers are now cutting the wafer into grains, and then rejecting the unqualified grains, but because the gap between the cut grains is very small, the unqualified grains In the process of rejection, it is easy to collide with adjacent grains, causing chipping and scratching of adjacent grains, which reduces the quality of grains and affects the normal progress of subsequent processes.

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