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Single-sided stagnant PP laminating structure and method of circuit board for aerospace purpose

A technology for aerospace and circuit boards, which is applied in the field of non-flowing PP lamination structure on one side of aerospace circuit boards, can solve problems such as asymmetry, product batch waste, and increase production costs, and achieve an increase in pass rate, cost savings, and The effect of improving productivity

Active Publication Date: 2017-03-22
TIANJIN PRINTRONICS CIRCUIT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Circuit boards are also called circuit boards, PCB boards, etc. One side of the circuit board is equipped with parts, and the other side is equipped with wires. Through the combination of various components, the stable operation of each device is guaranteed. It is used in all walks of life today. Circuit boards need to be used. For example, in aerospace equipment, the electrical performance requirements of the circuit boards used are higher. At present, customers often need single-sided lamination and non-flowing PP products. The structure used for lamination is: by From bottom to top, they are steel plate, copper foil, PE film, release film, non-flowing PP, core plate, copper foil and steel plate. The copper foil is laminated on the core board on one side. Due to the asymmetrical laminate structure and the poor fluidity of the non-flowing PP, there will be uneven stress distribution after lamination (both non-flowing PP and PE films will generate stress). This will lead to different warpages in the final product. According to the process requirements, the warping rate should be less than 0.75%. It leads to waste of products in batches, resulting in low production efficiency and greatly increasing production costs.

Method used

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  • Single-sided stagnant PP laminating structure and method of circuit board for aerospace purpose

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Embodiment Construction

[0014] Below in conjunction with the examples, the present invention is further described, the following examples are illustrative, not limiting, and the protection scope of the present invention cannot be limited by the following examples.

[0015] A single-sided non-flowing PP lamination structure for aerospace circuit boards, such as figure 1 As shown, the innovation of the present invention is: from top to bottom are steel plate, copper foil, PE film 1, backing plate 2, core plate 3, non-flowing PP4, release film, PE film, copper foil and steel plate, located at the top The PE film is equal to or slightly smaller than the size of the core board, and the backing board is a copper clad board.

[0016] The thickness of the PE film on the top is 0.2-0.35 mm, the thickness of the epoxy resin in the middle of the backing plate is 0.2 mm, and the thickness of the copper foil on the upper and lower end surfaces of the epoxy resin is 18 microns. Each side of the release film is 2-...

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Abstract

The invention relates to a single-sided stagnant PP laminating structure of a circuit board for an aerospace purpose. The single-sided stagnant PP laminating structure sequentially comprises a steel plate, copper foil, a PE film, a base plate, a core plate, stagnant PP, a release film, the PE film, the copper foil and the steel plate from top to bottom, wherein the size o the PE film at the upper part is equal to or slightly smaller than that of the core plate and the base plate is a copper-clad plate. According to the single-sided stagnant PP laminating structure, after the PE films and the base plate are added, the structures of upper and lower layers are approximately symmetrical, the PE film at the upper part can offset stress generated by the PE film at the lower part, and the base plate can offset the stress generated by the stagnant PP, so that the defect that the plate warping rate of a single-sided laminated stagnant PP product is over-high is avoided, the plate warping rates of different products are smaller than 0.5% and are much smaller than 0.75% requested by the process through random sampling inspection after mass production, the qualified rate of various batches of products is greatly improved, the production efficiency is improved and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of improving the manufacturing process of circuit boards for aerospace, in particular to a single-sided non-flowing PP lamination structure and method for circuit boards for aerospace. Background technique [0002] Circuit boards are also called circuit boards, PCB boards, etc. One side of the circuit board is equipped with parts, and the other side is equipped with wires. Through the combination of various components, the stable operation of each device is guaranteed. It is used in all walks of life today. Circuit boards need to be used. For example, in aerospace equipment, the electrical performance requirements of the circuit boards used are higher. At present, customers often need single-sided lamination and non-flowing PP products. The structure used for lamination is: by From bottom to top, they are steel plate, copper foil, PE film, release film, non-flowing PP, core plate, copper foil and steel plate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4626H05K2201/09136H05K2203/06
Inventor 吴云鹏
Owner TIANJIN PRINTRONICS CIRCUIT CORP