Single-sided stagnant PP laminating structure and method of circuit board for aerospace purpose
A technology for aerospace and circuit boards, which is applied in the field of non-flowing PP lamination structure on one side of aerospace circuit boards, can solve problems such as asymmetry, product batch waste, and increase production costs, and achieve an increase in pass rate, cost savings, and The effect of improving productivity
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[0014] Below in conjunction with the examples, the present invention is further described, the following examples are illustrative, not limiting, and the protection scope of the present invention cannot be limited by the following examples.
[0015] A single-sided non-flowing PP lamination structure for aerospace circuit boards, such as figure 1 As shown, the innovation of the present invention is: from top to bottom are steel plate, copper foil, PE film 1, backing plate 2, core plate 3, non-flowing PP4, release film, PE film, copper foil and steel plate, located at the top The PE film is equal to or slightly smaller than the size of the core board, and the backing board is a copper clad board.
[0016] The thickness of the PE film on the top is 0.2-0.35 mm, the thickness of the epoxy resin in the middle of the backing plate is 0.2 mm, and the thickness of the copper foil on the upper and lower end surfaces of the epoxy resin is 18 microns. Each side of the release film is 2-...
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