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Film molded article, film packaged body using same, manufacturing method for film molded article and manufacturing method for film packaged body

A manufacturing method and a technology for a formed body, which are applied in the directions of packaging, transportation, packaging, and application, can solve problems such as increased manufacturing cost, and achieve the effects of improving productivity, sealing performance and excellent appearance characteristics.

Active Publication Date: 2017-04-19
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as in Patent Document 3, in order to form a recess corresponding to the size and other overall shape of the battery cell for accommodating the battery cell, the manufacturing equipment such as the mold used also needs to be large-scale equipment, so there is a problem that the manufacturing cost increases.

Method used

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  • Film molded article, film packaged body using same, manufacturing method for film molded article and manufacturing method for film packaged body
  • Film molded article, film packaged body using same, manufacturing method for film molded article and manufacturing method for film packaged body
  • Film molded article, film packaged body using same, manufacturing method for film molded article and manufacturing method for film packaged body

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Experimental program
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Embodiment Construction

[0096] Hereinafter, embodiments of the formed film article of the present invention, a film package using the same, a method for manufacturing the formed film article, and a method for producing the film package will be described with reference to the drawings.

[0097] [Molded film and method for producing the same]

[0098] Below, refer to Figure 1 to Figure 6 The film molded body 1 and its manufacturing method of this embodiment are demonstrated.

[0099] Such as figure 1 As shown, the formed film 1 of the present embodiment has a plurality of concave or convex embossed parts 3 arranged at intervals on the surface 2 a of the film 2 . Moreover, these several embossed parts 3 are arrange|positioned on the surface of the film 2, and are surrounded by several embossed parts 3 and the imaginary line 4a which linearly connects each of these several embossed parts 3. The surrounding area 4.

[0100] The film molded article 1 of the present embodiment can be used, for example, ...

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Abstract

This film molded article (1) is configured so that a plurality of recessed or protruding embossed portions (3) that are disposed so as to be separated from each other are formed on a surface (2a) of a film (2), and the plurality of embossed portions (3) are disposed on the surface of the film (2) so as to form an enclosed region (4) that is surrounded by imaginary lines (4a) which connect the plurality of embossed portions (3) and connect the areas between the plurality of embossed portions (3).

Description

technical field [0001] The present invention relates to a film molded article, a film package using the same, a method for producing a film molded article, and a method for producing a film package. [0002] This application claims priority based on Japanese Patent Application No. 2014-153763 filed in Japan on July 29, 2014, and Japanese Patent Application No. 2015-059854 filed in Japan on March 23, 2015, and the contents thereof are incorporated herein. Background technique [0003] Conventionally, film materials formed of laminated films, metal foils, etc. are used, for example, in packages of various commodities such as cosmetics, or exteriors of lithium-ion secondary batteries (for example, refer to Patent Documents 1 and 2). In the case of using this film material to package packaged objects such as cosmetics or battery units, the following method is adopted: after clamping these packaged objects with a pair of film materials, they are sealed with adhesive or heat-seali...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C51/08B21D33/00B29C51/10B65D75/30H01M2/02H01M50/105
CPCB21D33/00B29C51/08B29C51/10B65D75/30B29L2031/712B29L2031/7162B29K2023/12B29K2077/00B29C51/14B29K2705/02B29K2705/00B21D22/04B29C59/026Y02E60/10H01M50/105B65D71/10B65D75/002B65D75/12B65D75/20H01M50/102H01M50/124H01M50/138
Inventor 小川浩野上光秀中武纯夫
Owner SEKISUI CHEM CO LTD