Cleaning equipment cleaning brush after cmp concentric locking structure and usage method

Abstract

Disclosed are a concentric clamping structure of a cleaning brush of a CMP post-cleaning device, and a usage method. The structure comprises a cleaning brush (1), an idle shaft structure (2) positioned, via a tapered hole, and transferring a force, via a rectangular groove, with the cleaning brush (1), a telescopic drive shaft structure (3) positioned, via a tapered hole, and transferring a force uniformly in four directions with the cleaning brush (1), a left swing frame (4) for supporting the idle shaft structure (2), and a right swing frame (5) for supporting the telescopic drive shaft structure (3). The cleaning brush (1) comprises a brush shaft (6) and a brush (7) sheathed on the brush shaft (6). A right end of the brush shaft (6) is provided with a centring tapered shaft (6.1) and a square shaft (6.2) which are concentric with the telescopic drive shaft structure (3). A left end of the brush shaft (6) is provided with a centring tapered shaft (6.3) and a rectangular shaft (6.4) which are concentric with the idle shaft structure (2). A pure water inlet (6.5) in communication with an inner cavity of the brush shaft (6) is arranged in the centre of the centring tapered shaft (6.3). The structure is compact and concise, optimizes a cleaning brush clamping layout mode, can effectively improve the clamping concentricity of same, and the airtightness of a pure water penetrating connector end, and has a convenient fast replacement performance.

Description

technical field [0001] The invention relates to a concentric clamping structure of a cleaning brush of cleaning equipment after CMP, and a method for using the concentric clamping structure. Background technique [0002] CMP (chemical mechanical Polishing) post-cleaning equipment is equipment for surface precision cleaning after high-precision polishing on the surface of electronic device wafers. In the post-CMP cleaning process, scrubbing with a brush combined with a spray medium is an effective way to remove contaminants on the wafer surface. [0003] At present, the overseas prototypes of post-cleaning equipment that can be seen are connected to the cleaning brush in the following way: the cleaning brush idler shaft unit and the cleaning brush drive shaft unit are superimposed as one. This clamping method results in a complex structure of the equipment and concentrated functions, especially when the two ends of the cleaning brush are docked with square positioning, resul...

AI Technical Summary

Problems solved by technology

[0005] The present invention provides a concentric clamping structure and usage method of cleaning brushes of post-CMP cleaning equipment. It is necessary to solve the problem of complex cleaning brush clamping structure of existing post-CMP cleaning equipment, large concentricity deviation of two ends of cleaning brushes, and poor wetting effect of cleaning brushes. , technical problems such as poor cleaning effect and inconvenient replacement

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