Aperture punching and forming integrated grading die
Patent Information
- Authority / Receiving Office
- CN ยท China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ๅๅฐ็ด
- Publication Date
- 2017-04-26
- Estimated Expiration
- Not applicable ยท inactive patent
Abstract
Description
technical field
[0001] The invention relates to the technical field of molds, in particular to an automatic high-precision progressive mold integrating small hole punching and forming. Background technique
[0002] At present, in the production process of multiple small holes with small spacing between holes, three processes can be used to achieve: 1) single-process die stamping forming process: use multiple pairs of single-process dies to stamp the small holes, and then use a pair of single-process dies to form small holes. Products required for die stamping; 2) Laser etching process: first use single-process molds or other molds to manufacture the required products into semi-finished products, and then use the high heat energy generated by the laser generator to etch the semi-finished products. Forming; 3) Drilling and forming process of high-speed drilling machine: drilling and forming small holes one by one. The common disadvantages of the above processes are: long proc...