Copper electroplating groove inlet section and outlet section water blocking buffer apparatus

Abstract

The present invention relates to the technical field of electroplating equipment, more particularly to a copper electroplating groove inlet section and outlet section water blocking buffer apparatus, which comprises a main conveying chain, a sub-conveying device and a water blocking buffer device, wherein the sub-conveying device comprises a sub-conveying wheel upper fixation seat, a sub-conveying wheel lower fixation seat, a sub-conveying wheel shaft, a first sub-conveying wheel, a second sub-conveying wheel and a third sub-conveying wheel, the sub-conveying wheel shaft is arranged between the sub-conveying wheel upper fixation seat and the sub-conveying wheel lower fixation seat, the first sub-conveying wheel is rotatably connected to the upper end of the sub-conveying wheel shaft, and the second sub-conveying wheel is rotatably connected to the lower end of the sub-conveying wheel shaft. According to the present invention, with the copper electroplating groove inlet section and outlet section water blocking buffer apparatus, it is ensured that the liquid level in the copper groove is maintained at a certain height, such that the liquid in the copper groove maintains the stable and low water flow pressure and the water flow rate, and the phenomenon that the liquid impact causes the plate snapping and the wrinkling of the electroplating substrate cannot be generated when the electroplating substrate enters the copper electroplating groove inlet section and outlet section water blocking buffer apparatus so as to ensure the product quality.

Description

technical field [0001] The invention relates to the technical field of electroplating equipment, in particular to a water retaining and buffering device for an inlet and outlet section of an electroplating copper tank. Background technique [0002] In continuous electroplating equipment, especially in the inlet and outlet section of the electroplating copper tank, since the notch of the copper tank is usually open, the water flow in the inlet and outlet section is too large, which can easily cause the plated substrate to be jammed or deformed. Wrinkles and other phenomena, in order to improve this situation, a water retaining device is usually installed at the entrance and exit of the copper tank. However, the traditional water retaining device has the following defects: First, the water retaining device does not have a water retaining buffer box. The rubber water-retaining wheel retains water. This kind of device has poor water-retaining effect. Due to the large water flow,...

AI Technical Summary

Problems solved by technology

[0002] In continuous electroplating equipment, especially in the inlet and outlet section of the electroplating copper tank, since the notch of the copper tank is usually open, the water flow in the inlet and outlet section is too large, which can easily cause the plated substrate to be stuck or deformed. Wrinkles and other phenomena, in order to improve this situation, a water retaining device is usually installed at the entrance and exit of the copper tank. However, the traditional water retaining device has the following defects: First, the water retaining device does not have a water retaining buffer box. The rubber water-retaining wheel retains water. This kind of device has poor water-retaining effect. Due to the large water flow, it is still impossible to avoid the electroplating substrate being impacted by the water flow after it comes out of the rubber water-retaining wheel, causing the phenomenon of jamming or wrinkling; second, the water retaining The device is not synchronized with the main drive, and a separate motor drive is added, which not only increases the manufacturing cost, but also cannot ensure that the transmission mechanism on the water retaining device is synchronized with the main drive, which can easily cause damage to the electroplating substrate

Images