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A test method for microscopic deformation of materials

A test method and material microscopic technology, applied in the direction of analyzing materials, measuring devices, instruments, etc., can solve problems such as single measurement function, and achieve the effect of solving relatively single measurement function

Active Publication Date: 2019-02-22
INST OF NUCLEAR PHYSICS & CHEM CHINA ACADEMY OF
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  • Abstract
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  • Application Information

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Problems solved by technology

Therefore, in the current state of technology where the measurement function of the existing method is relatively single, it is necessary to realize a test method that can meet the above-mentioned multiple requirements at the same time to deeply reveal the microscopic deformation mechanism of the material, and it is one of the powerful ways to establish the relationship between material properties and microstructure

Method used

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  • A test method for microscopic deformation of materials
  • A test method for microscopic deformation of materials
  • A test method for microscopic deformation of materials

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Embodiment 1

[0030] Such as image 3 Shown, the concrete steps of the testing method of material microscopic deformation of the present invention are as follows:

[0031] a. Symmetrical diffraction experiment layout

[0032] Place the stress loading device 1 on the load-bearing platform 2 of the diffraction experimental device, ensuring that the central axes of the two coincide. Then, the ray source 16 and the detector 21 are respectively arranged on both sides of the stress loading device 1 to form a basic geometric layout of the diffraction experiment in a symmetrical distribution. At the same time, the entrance aperture 17 and the exit aperture 20 are respectively placed at the front ends of the radiation source 16 and the detector 21 , and arranged close to the stress loading device 1 .

[0033] b. Two-channel acoustic detection arrangement

[0034] The sample 3 is installed on the stress loading device 1 through the clamp 4, and at the same time, the sample 3 is stretched to a pre-...

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Abstract

The invention provides a testing method for microscopic deformation of a material. The method employs a combination of symmetric diffraction experiments and dual-channel acoustic detection to test information about evolution of a microstructure in a sample in the whole stress loading process and realizes direct in-situ nondestructive measurement of inner static and dynamic microscopic deformation information of a block material. According to the method, a corresponding measurement crystal face is selected according to the crystal structure of the sample; and in a geometric layout that a radiation source and a detector are symmetrically arranged at two sides of a stress loading device, static microscopic deformation information including interplanar spacing, oriented direction and the like in different stress loading phases are measured by using diffraction experiments, and dynamic microscopic deformation like twin crystal nucleation and dislocation movement in the process of stress loading are continuously measured by using a dual-channel acoustic probe. The testing method for the microscopic deformation of the material is applicable to monitoring and analysis of inner microscopic mechanism and process of metal alloy materials in the process of macroscopic stress loading and to testing of characteristic deformation information like fracture failure of non-metal alloy materials.

Description

technical field [0001] The invention belongs to the technical field of analysis and testing of mechanical properties of materials, and in particular relates to a testing method for microscopic deformation of materials. Background technique [0002] Establishing the relationship between structure and performance is a very challenging topic in materials science, and it is also a key prerequisite for in-depth understanding of the nature of material performance and the realization of controllable design of materials. Without exception, the mechanical behavior of materials is also closely related to the internal multi-scale microstructure (such as vacancies, dislocations, crystal / phase boundaries, grains, etc.). Therefore, mastering the microstructure change law of materials during stress loading is an important content for understanding the deformation mechanism of materials. Moreover, from the perspective of material service, it has become an inevitable trend to build a model ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/06G01B15/06G01B17/04
CPCG01B15/06G01B17/04G01N3/06
Inventor 张昌盛庞蓓蓓张莹王云王虹李建孙光爱
Owner INST OF NUCLEAR PHYSICS & CHEM CHINA ACADEMY OF
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