Chip packaging structure and manufacturing method therefor

Abstract

Embodiments of the invention provide a chip packaging structure. The chip packaging structure comprises a substrate, a plurality of chips and a plurality of separation devices which are packaged on the upper surface of the substrate, and a heat dissipation apparatus, wherein the heat dissipation apparatus comprises an insulating layer and a heat conduction layer which are arranged in a laminating manner; and the insulating layer fully coats and is attached to the outer surfaces of the multiple chips and separation devices and the upper surface of the substrate, and is used for transferring heat generated by the multiple chips and separation devices to the heat conduction layer and the substrate, so as to dissipate the heat generated by the multiple chips and separation devices through the heat conduction layer and the substrate. In addition, the embodiments of the invention also provide a manufacturing method for the chip packaging structure. The chip packaging structure, by setting the heat dissipation apparatus, can realize uniform and efficient system-level chip packaging heat dissipation.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a chip packaging structure and a manufacturing method thereof. Background technique [0002] With the continuous decline of chip process nodes, the integration level of chips continues to rise. Small size, high speed, and high performance have become the development trend of electronic devices. The number of transistors per unit area in a chip is increasing, and the power density is also increasing. The thermal management of the chip is becoming more and more challenging. In a System-in-Package (SiP) structure, multiple heterogeneous chips and discrete devices are packaged and integrated into a small-sized system. Because different chips have different power consumption under different working conditions, the system-in-package structure is prone to problems such as heat accumulation and uneven heat dissipation. At present, the common technology to improve the heat dissi...

AI Technical Summary

Problems solved by technology

However, this heat dissipation method cannot achieve rapid and uniform heat dissipation of multiple heterogeneous chips and discrete devices for system-in-chip packaging, which is not conducive to improving the heat dissipation efficiency of system-in-chip packaging

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