Airborne lru liquid cooling source

Abstract

The invention discloses an onboard LRU liquid cooling source and aims to provide a liquid cooling source capable of meeting the harsh environmental condition requirements of an onboard platform and also meeting the heat dissipation requirements of multi-path loads at the same time. According to the technical scheme of the invention, a distributary and conflux assembly is divided into two different cavities, namely a conflux cavity and a distributary cavity. The upper part of the conflux cavity is provided with an air cavity for air inflation. The bottom of the air cavity is provided with a funnel used for supplying the coolant liquid to a pump unit at various flight attitudes of an aircraft. A hoop arranged on the outside of the pump unit is provided with heat radiating teeth for heat radiating purpose. The coolant liquid flows into the conflux cavity to be converged after flowing through the distributary and conflux assembly. The converged coolant liquid flows into a filter to be filtered through a pipe assembly and then the heat of the converged coolant liquid is radiated through a heat radiating assembly. After that, the coolant liquid flows into the pump unit to flow to the distributary cavity to be distributed. Finally, the cooled coolant liquid is outputted, so that the heat exchange process of the coolant liquid is completed at a time. According to the invention, the heat dissipation requirements of multi-path loads can be met while no extra installation space is required at the same time. The onboard LRU liquid cooling source can meet the heat dissipation requirements of multi-path loads, such as one set of loads, two sets of loads, three sets of loads, four sets of loads and the like.

Description

technical field [0001] The invention relates to a liquid cooling source, in particular to an airborne Field Replaceable Unit (LRU) liquid cooling source. Background technique [0002] With the development of electronic technology and the continuous improvement of packaging density, the thermal control of electronic equipment is becoming more and more important. This is mainly due to the increase in power density, high thermal stress will cause high failure rate, lower life cycle and higher maintenance cost. Thermal stress has become a major cause of failure of electronic equipment, and the control of thermal stress will become a prominent problem in avionics equipment in the future. In electronic equipment and even in many mission-critical equipment, shelf products COTS (Components off the Shelves, COTS) are widely used. In order to reduce costs, major companies in the world have begun to adopt the idea of ​​shelf products for product development, using a large number of in...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem that avionics equipment with high heat consumption needs liquid cooling for heat dissipation and cooling, and the carrier platform cannot provide cooling liquid, the present invention provides a , the onboard LRU liquid cooling source that can meet the heat dissipation needs of multiple loads at the same time

Images