Mother board and its production method, cover board and its production method, and display device

A cover plate and motherboard technology, applied in the field of display devices, motherboards and their preparation, can solve the problems of bubbles in the glue layer, increase the overall thickness of the display module, etc.

Inactive Publication Date: 2017-05-31
BOE TECH GRP CO LTD
View PDF5 Cites 31 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, in order to solve the problems of the prior art, the embodiments of the present invention provide a motherboard and its preparation method, a cover plate and its preparation method, and a display device, which solve the problems caused by th

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mother board and its production method, cover board and its production method, and display device
  • Mother board and its production method, cover board and its production method, and display device
  • Mother board and its production method, cover board and its production method, and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] It should be noted that, unless otherwise defined, all terms (including technical and scientific terms) used in the embodiments of the present invention have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It should also be understood that terms such as those defined in common dictionaries should be interpreted as having meanings consistent with their meanings in the cont...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thickness rangeaaaaaaaaaa
Thickness rangeaaaaaaaaaa
Login to view more

Abstract

An embodiment of the invention provides a mother board and its production method, a cover board and its production method, and a display device, relates to the technical field of displaying, and solves the problem that bubbles occur to a glue layer in the upper surface of the cover board due to gaps in the decorative ink edge. The cover board may be attached to a display panel through a thin glue layer so that total thickness of a display module is increased. The production method of the mother board comprises: forming an ink pattern layer on a substrate baseplate, wherein the ink pattern layer includes a plurality of hollowed-out areas; forming hardening liquid covering the ink pattern layer on the substrate base plate by means of coating; curing the hardening liquid to form a hardened layer covering the ink pattern layer. The production method is used for producing a mother board comprising the cover board.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a motherboard and a preparation method thereof, a cover plate and a preparation method thereof, and a display device. Background technique [0002] Flexible display devices have attracted extensive attention due to their features such as free bending, lightness, and drop resistance. In order to realize the bendability of the flexible display device and even achieve the effect of foldable display, it is necessary to make its module structure as thin as possible to meet the requirement of a smaller bending radius. [0003] Such as figure 1 As shown, the protective cover of a flexible display device is usually composed of a plastic substrate, and its surface is sequentially formed with a hardened coating with a certain scratch resistance and a functional layer (such as an anti-reflection coating and an anti-fouling coating). Decorative inks of black, white or other colors are pri...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G09F9/30
CPCG09F9/301G02F2202/28G02F1/133305G02F1/133325G09F9/33H10K77/111
Inventor 毛雪
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap