Mother board and its production method, cover board and its production method, and display device

Abstract

An embodiment of the invention provides a mother board and its production method, a cover board and its production method, and a display device, relates to the technical field of displaying, and solves the problem that bubbles occur to a glue layer in the upper surface of the cover board due to gaps in the decorative ink edge. The cover board may be attached to a display panel through a thin glue layer so that total thickness of a display module is increased. The production method of the mother board comprises: forming an ink pattern layer on a substrate baseplate, wherein the ink pattern layer includes a plurality of hollowed-out areas; forming hardening liquid covering the ink pattern layer on the substrate base plate by means of coating; curing the hardening liquid to form a hardened layer covering the ink pattern layer. The production method is used for producing a mother board comprising the cover board.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a motherboard and a preparation method thereof, a cover plate and a preparation method thereof, and a display device. Background technique [0002] Flexible display devices have attracted extensive attention due to their features such as free bending, lightness, and drop resistance. In order to realize the bendability of the flexible display device and even achieve the effect of foldable display, it is necessary to make its module structure as thin as possible to meet the requirement of a smaller bending radius. [0003] Such as figure 1 As shown, the protective cover of a flexible display device is usually composed of a plastic substrate, and its surface is sequentially formed with a hardened coating with a certain scratch resistance and a functional layer (such as an anti-reflection coating and an anti-fouling coating). Decorative inks of black, white or other colors are pri...

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Problems solved by technology

[0005] In view of this, in order to solve the problems of the prior art, the embodiments of the present invention provide a motherboard and its preparation method, a cover plate and its preparation method, and a display device, which solve the problems caused by the step difference on the upper surface of the cover plate due to the edge of the decorative ink. Bubbles appear in the glue layer. A thinner glue layer can be used to bond the cover and display panel to avoid increasing the overall thickness of the display module.

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