Circuit board, crimping method and electronic equipment
A circuit board, pressure technology, applied in the directions of printed circuits, electrical components, printed circuits, etc., can solve the problems of low work efficiency and complex methods, and achieve the effect of high work efficiency and simple operation
Active Publication Date: 2017-05-31
SHANGHAI AVIC OPTOELECTRONICS +1
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Problems solved by technology
It can be seen that in the existing crimping process of circuit boards and conductive parts, the method of judging the effect of crimping is complicated and the work efficiency is low
Method used
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[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0029] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0030] refer to figure 1 with figure 2 , figure 1 A section view of a circuit board provided by an embodiment of the present invention, figure 2 It is a top view of a circuit board provided by an embodiment o...
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The invention discloses a circuit board, a crimping method and electronic equipment. The circuit board comprises a first base material layer, a conducting layer arranged on the surface of the first base material layer, a second base material layer on the side, opposite to the first material layer, of the conducting layer, and a developing layer arranged on the side, opposite to the conducting layer, of the first base material layer, wherein the conducting layer comprises a conducting wire and at least one golden finger electrically connected with the conducting wire; the second base material layer covers the conducting wire; when the circuit board is crimped with a conducting element, the golden finger is bonded to the conducting element through conducting resin; a color formation layer is arranged on the surface of the developing layer; when the color formation layer is stressed and meets a preparatory condition, a material in the color formation layer reacts with a material in the developing layer, so that developing layer displays a design color; the color formation layer is peeled with the developing layer after crimping is accomplished. According to the method, the crimping effect can be judged through color change, the method is simple to operate, and the operating efficiency is high.
Description
technical field [0001] The present invention relates to the technical field of electronic equipment, and more specifically, relates to a circuit board, a crimping method and electronic equipment. Background technique [0002] In electronic equipment, it is often necessary to use the crimping process to electrically connect the circuit board to the conductive parts. For example, for display devices, it is necessary to use the crimping process to electrically connect the FPC (flexible circuit board) to the circuit on the array substrate, or to use the crimping process The FPC is electrically connected to the circuit on the color film substrate, or the PCB (printed circuit board) main board is electrically connected to the circuit on the array substrate by a crimping process, or the PCB main board is electrically connected to other electrical components by a crimping process. [0003] The circuit board has gold fingers, and the gold fingers are correspondingly electrically conn...
Claims
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IPC IPC(8): H05K1/02H05K3/32
CPCH05K1/0269H05K3/321H05K2201/09818
Inventor 朱志峰
Owner SHANGHAI AVIC OPTOELECTRONICS